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www: | www.zetech.co.za |
more information about ZETECH ONE |
The NCM5000 dispense pump from GPD Global makes for easy jetting and, with only two wetted parts and no seals or springs to replace or adjust, simplifies field operation.
The pump uses a reliable, high-speed
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SolderStar’s innovative APS (Automatic Profiling System) uses the latest evolution of reflow data logger to provide a full time process monitoring solution capable of providing a profile for every board
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Miyachi has released the newly updated ML-73 D series fibre laser markers, ideal for high-power and high-speed laser marking, laser engraving, laser ablation and laser annealing of metals, plastics and
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Zetech will be exhibiting a comprehensive offering of production and test equipment, accessories and consumables.
On display will be Yamaha’s YS24X pick-and-place machine; KOKI’s range of solder paste,
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Building on the recent introduction of its FuzionXC platform, Universal Instruments’ comprehensive Fuzion solutions portfolio features an expansive complement of configurations and capabilities designed
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The contract manufacturer has increased its capacity with the newly installed machines and associated software.
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The Vitronics Soltec 6746 is a selective soldering automation work cell that delivers high throughput and flexibility while minimising its footprint in the factory. Inline processes and intuitive programming
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MARTIN announced that infrared (IR) temperature measurement sensors are now available on its EXPERT 10.6 rework systems. IR measurement is used to determine temperatures on surfaces from a distance, without
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PVA is launching its new PVA710 optical bonding system at this year’s IPC APEX Expo. The system is used to dispense optical bonding adhesives and assemble optical devices in atmosphere without bubbles.
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Martin’s Mini-Oven 04 Reball/Prebump unit is ideal for the complete QFN solder bumping process, even for the smallest pitches. Using unique Hotprint technology, the mask is not removed after printing
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Electronics are now a fundamental part of our everyday lives. As we become more technically competent and dependent, so our demands and expectations grow.
Today, as consumers, we now expect increased
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With 3D solder paste inspection (SPI) becoming more and more established and offered by multiple suppliers, it is often assumed that this is the final stage in solder paste inspection. A closer look as
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