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more information about Test & Rework Solutions |
OK International has introduced a new mid-range series of feature-rich Techcon Systems' Digital Dispenser/Controllers. The microprocessor-driven, digital-timer DX-300 Series, dispenses precise fluid profiles
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The Gold-Place pick-and-place systems from Automated Production Systems, Models L20, L40, L60, are highly accurate, fully-automatic pick-and-place systems that are easy to program and use, and are capable
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For detecting manufacturing defects such as positional, missing, skewed, misplaced, incorrect device, incorrect polarity, solder and lead defects, Diagnosys says its ScanPoint DT is fast and reliable.
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With the introduction of the PS-800 Soldering System, the Metcal division of OK International has made a most significant change in hand soldering since the introduction of its patented SmartHeat technology
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The economic realities of quality control, rework cost and need for customer confidence make automated optical inspection (AOI) a necessity in circuit board manufacturing environments. AOI can take a
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DiagnoSYS has signed an agreement with XJTAG, a specialist design and test tool developer, to enable it to integrate the XJTAG boundary scan development system into its PinPoint II advanced in-circuit
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Metcal has developed a compact and portable two-arm fume extraction system that combines strong fan performance with efficient filtration and quiet, flexible operation. Metcal enlisted the fume extraction
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Metcal's BVX-100 fume extraction system is a portable, single-user system claimed to have the power of a larger, multi-user system.
Compared with larger, multi-user fume extraction systems the BVX-100
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When it comes to reworking BGAs, CSPs, land grid arrays (LGAs), micro SMDs, micro-lead frames (MLFs) and bumped chip components, an important key to success is vision: the ability to see, align and accurately
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The US Air Force projects it will turn a small $485 000 investment for four PinPoint II Testers, from DiagnoSYS, into $13-plus million in cost avoidance to re-host more than 100 previously developed software
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This article describes the process of reworking BGA or CSP components when lead-free solder is being used.
Basically, the steps to remove and replace BGA/CSPs are straightforward: 1. Establish thermal
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This document was commissioned by Vision Engineering, world leaders in the development and manufacture of stereo optical inspection systems. The report explains the basic assembly process for modern printed
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