EBV Electrolink

Tel: +27 11 236 1900
Email: [email protected]
www: www.ebv.com
more information about EBV Electrolink

FlightSense multi-zone ToF sensor
27 July 2022, DSP, Micros & Memory

STMicroelectronics has revealed FlightSense multi-zone ToF sensor for gesture recognition, intruder alert, and human presence detection to be used in front of PCs. The cost-effective non-vision-based turnkey solution detects user presence, recognises gestures, and protects against ‘shoulder surfers’ for smoother interactions, enhanced security, and power saving.
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Samsung begins chip production using 3 nm process technology
27 July 2022, Electronics Technology

The optimised 3 nm process with GAA architecture achieves 45% lower power usage, 23% improved performance and 16% smaller surface area compared to 5 nm process.
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Samsung unveils new image sensor with industry’s smallest pixel size
27 July 2022, News

The ISOCELL sensor, with a pixel size of 0,56 µm, enables more accurate and quicker auto-focusing and can reduce the module area by 20%.
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Lowering the cost of solar PV inverters
27 July 2022, Passive Components

Vishay has turned its attention to lowering the cost of solar PV inverters and by reducing the number of electrolytic capacitors required.
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AMD Xilinx online training: Vivaldo ML tools
27 July 2022, Computer/Embedded Technology

The webinar will explore the features of SystemVerilog that are useful for RTL synthesis using Vivado ML Tools and how the RTL SystemVerilog language constructs have been optimised for productivity and reliability.
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New high current through-hole inductors
27 July 2022, Passive Components

Vishay has released a high current, through-hole inductor for use in high current and high temperature applications, DC/DC converters, high current differential chokes and inverters.
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Samsung launches GDDR6 RAM module
27 July 2022, Computer/Embedded Technology

The DRAM is capable of 24 Gbps processing speeds and will significantly advance the graphics performance of AI-based applications and high-performance computing.
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SolidRun releases a SoM solution based on a Renesas SoC
27 July 2022, DSP, Micros & Memory

In partnership with Renesas, SolidRun has released a SoM solution based on the powerful RZ/G2 family of SoCs, which are engineered for AI-enhanced HMI applications.
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Programmable Bluetooth low-energy wireless SoC
27 July 2022, Telecoms, Datacoms, Wireless, IoT

The next-gen BlueNRG-LPS SoC, a Bluetooth low-energy 5.3 enabled device, can precisely estimate movement and location with centimetre accuracy.
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Mastering the MicroBlaze processor
29 June 2022, DSP, Micros & Memory

AMD-Xilinx and Adiuvo will present a hands-on workshop on using the MicroBlaze processor on the Spartan-7 evaluation kit to create, develop and deploy an FPGA solution.
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Low power 36 V operational amplifier
29 June 2022, Analogue, Mixed Signal, LSI

The TSB622 is a general-purpose, dual operational amplifier featuring an extended supply voltage operating range of 2,7 to 36 V and rail-to-rail output
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High-power semiconductor solutions for green hydrogen electrolyser applications
29 June 2022, News

Gain insights into AC- and DC-coupled electrolyser applications and learn about Infineon’s best-in-class semiconductor solutions in the upcoming webinar.
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