Samsung has announced the industry’s first 16-gigabit (Gb) Graphics Double Data Rate 6 (GDDR6) DRAM featuring 24-gigabit-per-second (Gbps) processing speeds. Built on Samsung’s third-generation 10-nm-class process using extreme ultraviolet (EUV) technology, the new memory is designed to significantly advance the graphics performance of artificial intelligence-based applications and high-performance computing (HPC) systems as well as next-generation commercial units like graphics cards and laptops.
“The explosion of data now being driven by AI and the metaverse is pushing the need for greater graphics capabilities that can process massive data sets simultaneously, at extremely high speeds,” said Daniel Lee, executive vice president of the memory product planning team at Samsung. “With our industry-first 24 Gbps GDDR6 now sampling, we look forward to validating the graphics DRAM on next-generation GPU platforms to bring it to market in time to meet an onslaught of new demand.”
Engineered with an innovative circuit design and a highly advanced insulating material (High-K Metal Gate; HKMG) that minimises current leakage, Samsung’s GDDR6 will deliver 30% faster speeds compared to the previous 18 Gbps product and will be capable of data transfer up to 1,1 TB of data per second.
KIOXIA pioneer new 3D Flash technology EBV Electrolink
DSP, Micros & Memory
KIOXIA Corporation and Sandisk Corporation have pioneered a state-of-the-art 3D flash memory technology, setting the industry benchmark with a 4,8 Gb/s NAND interface speed, superior power efficiency, and heightened density.
Read more...Unlock enhanced wireless performance
Computer/Embedded Technology
Duxbury Networking has introduced Cambium Networks’ Deep Virtual Circuit (Deep VC) technology, a free upgrade for the PMP 450 platform that will transform wireless broadband performance across the country.
Read more...Super-fast H.264 encoder FPGA core EBV Electrolink
DSP, Micros & Memory
An ITAR-compliant H.264 core designed for AMD FPGAs provides baseline H.264 support and is currently the smallest and fastest FPGA core in the industry.
Read more...Power IC supplies 1650 W EBV Electrolink
Power Electronics / Power Management
Power Integrations has announced a two-fold increase in power output from the HiperLCS-2 chipset with the new device now being able to deliver up to 1650 W of continuous output power.
Read more...Computing in industrial environments Vepac Electronics
Computer/Embedded Technology
The Panasonic Toughbook CF-33/CF33 Tablet is a 12,0-inch fully rugged device with hot-swappable twin batteries and highly configurable capabilities.
Read more...DDR5 DRAM series Vepac Electronics
Computer/Embedded Technology
Innodisk has announced its DDR5 6400 DRAM series featuring the industry’s largest 64GB single-module capacity.
Read more...Generate waveforms at 10 GS/s Vepac Electronics
Computer/Embedded Technology
New flagship arbitrary waveform generator cards from Spectrum Instrumentation generate waveforms with 2,5 GHz bandwidth and 16-bit vertical resolution.
Read more...Quad-port 10GBASE-T controller Rugged Interconnect Technologies
Computer/Embedded Technology
he SN4-DJEMBE, available from Rugged Interconnect, is a networking adaptor card for CompactPCI Serial systems, equipped with four individual controllers for 10GBASE-T.
Read more...Powering the intelligent edge EBV Electrolink
AI & ML
STMicroelectronics released new devices from the second generation of its industrial MPUs, the STM32MP2 series, to drive future progress in smart factories, smart healthcare, smart buildings, and smart infrastructure.
printer friendly version