27 April 2011Manufacturing / Production Technology, Hardware & Services
Multimedia, Videos
For this month’s featured defect, a sample via hole has been mounted in resin and micro-sectioned to look at the plating quality. The optical image clearly shows the resin surface at the back of the hole. This is a through-hole plating problem and closer examination of the plating is required. The centre of the side wall may show that the problem relates to the initial metallisation process or the electroplated copper.
The poor coverage in this example could have been caused by residues on the surface of the drilled hole that were removed during plating; equally it could be related to a gas bubble in the hole during plating. In the case of less obvious examples, a light is put behind the microsection to show up the degree of laminate coverage.
Auditing of the printed board fabrication process with samples examined after drilling up to the final copper through-hole plating process should be considered in this case. Optical examination of hole coverage and microsections should illustrate satisfactory process control.
The featured defect video for this month looks at the issue of component damage during wave soldering, and how this is influenced by the move to lead-free processes.
Dataweek has partnered with the UK's National Physical Laboratory (NPL) to feature instructional videos on various defects encountered in the manufacturing of electronic printed circuit boards.
Industry expert Bob Willis uses the NPL Defect Database to explain component damage when converting from tin lead to lead-free components.
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