27 April 2011Manufacturing / Production Technology, Hardware & Services
Multimedia, Videos
For this month’s featured defect, a sample via hole has been mounted in resin and micro-sectioned to look at the plating quality. The optical image clearly shows the resin surface at the back of the hole. This is a through-hole plating problem and closer examination of the plating is required. The centre of the side wall may show that the problem relates to the initial metallisation process or the electroplated copper.
The poor coverage in this example could have been caused by residues on the surface of the drilled hole that were removed during plating; equally it could be related to a gas bubble in the hole during plating. In the case of less obvious examples, a light is put behind the microsection to show up the degree of laminate coverage.
Auditing of the printed board fabrication process with samples examined after drilling up to the final copper through-hole plating process should be considered in this case. Optical examination of hole coverage and microsections should illustrate satisfactory process control.
The featured defect video for this month looks at the issue of component damage during wave soldering, and how this is influenced by the move to lead-free processes.
Dataweek has partnered with the UK's National Physical Laboratory (NPL) to feature instructional videos on various defects encountered in the manufacturing of electronic printed circuit boards.
Industry expert Bob Willis uses the NPL Defect Database to explain component damage when converting from tin lead to lead-free components.
New handle for the XP Series joystick Brabek
Manufacturing / Production Technology, Hardware & Services
The new MF handle meets market demands to combine a traditional compact design with multiple functionalities and customisation options.
Read more...Next-level conformal coating Techmet
Manufacturing / Production Technology, Hardware & Services
The ASYMTEK Select Coat SL-1040 Series is Nordson Electronics Solutions’ most advanced conformal coating solution for high-volume production.
Read more...The impact of ML in robotics
Manufacturing / Production Technology, Hardware & Services
The integration of machine learning into robotics has the potential to revolutionise many industries, and particularly the manufacturing sector.
Read more...ITW EAE wins product introduction award Allan McKinnon & Associates
Manufacturing / Production Technology, Hardware & Services
ITW EAE has earned a 2024 New Product Introduction (NPI) Award for Electrovert’s Deep Wave option for wave soldering machines.
Read more...Revolutionising clean air in electronics manufacturing Allan McKinnon & Associates
Manufacturing / Production Technology, Hardware & Services
Designed to prioritise clean air in the electronics manufacturing industry, the ZeroSmog Shield Pro sets a new standard for workplace health and safety.
Read more...High-speed multi-function dispensing Techmet
Manufacturing / Production Technology, Hardware & Services
The D-VIS and DL-VIS from GKG SMT printer specialists are high-speed dispensing systems that can handle multiple scenarios.
Read more...Optical inspection for SMT Techmet
Manufacturing / Production Technology, Hardware & Services
The Xpection 1860 from Scienscope is a versatile X-ray inspection machine that offers comprehensive circuit board defect detection and quality assurance for the SMT industry.
Read more...Yamaha introduces upgrades to its 3D AOI systems Truth Electronic Manufacturing
Manufacturing / Production Technology, Hardware & Services
Yamaha Robotics SMT section has revealed performance-boosting upgrades for the YRi-V 3D AOI system, including faster board handling, multi-component alignment checking, and enhanced LED coplanarity measurement.
Read more...Flexible printed electronics substrates
Manufacturing / Production Technology, Hardware & Services
New LEXAN CXT film from SABIC offers high thermal process stability and transparency for demanding printed electronics substrates.
Read more...Lead-free solder paste Techmet
Manufacturing / Production Technology, Hardware & Services
Indium8.9HF is an air reflow, no-clean solder paste specifically formulated to accommodate the higher processing temperatures required by SnAgCu, SnAg, and other alloys.
printer friendly version