Over more than six decades, IMP Electronics Solutions has built a reputation for technical expertise, reliable supply chains, and strong partnerships with both customers and manufacturing partners.
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Nitrogen in reflow soldering is often seen as a performance enhancer, offering improved wetting, shinier joints, and fewer defects. But it is not always necessary.
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When electronic components face the relentless demands of heavy industry or unpredictable outdoor elements, Takachi’s IP67 diecast aluminium enclosures provide a robust line of defence.
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New fuel gauge solution from Nordic delivers State-of-Health reporting, adaptive battery modelling, and seamless fleet observability via nRF Cloud.
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IOT Electronics has announced a new strategic partnership with Powell Electronics, becoming an Official Authorised Reseller in South Africa.
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By combining multiple soldering technologies within a single system, the Vision TripleX system enables manufacturers to adapt easily to different assembly requirements, board designs, and production volumes.
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The tool-free Heavycon series click-in module carrier frame from Phoenix Contact simplifies the assembly and installation of heavy-duty connectors significantly.
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In modern SMT lines, stencil printing must meet two requirements at the same time: it has to ensure a reproducible solder paste volume, while adhering to the specified line cycle time.
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Built on Ultra Narrow Band communication technology, the Sigfox network focuses on low power, wide area M2M connectivity rather than maximising data throughput.
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The Amphenol PCTEL GNSS-L125-DH-NF multi-GNSS antenna is a high-performance antenna designed for reliable global navigation satellite system reception in demanding environments.
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ESE’s solder paste printer now available in SA Engineered for high-speed, high-accuracy applications, the ESE ES-FA1 solder paste printer eliminates the traditional bottlenecks of manual stencil changes and paste management, making it an ideal solution for Tier 1 EMS providers and advanced semiconductor assembly.
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Inline vapour phase soldering for high-volume production The VP2200-100 vacuum inline vapour phase soldering system from ASSCON is designed for fully automated, high-volume electronics manufacturing where process consistency and solder joint quality are critical.
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Die-cast enclosures in non-rectangular formats These models from Hammond Manufacturing, the 1590TRP and 1590STP, provide additional flexibility for product designers who require strong aluminium enclosures, but want alternatives to the traditional rectangular form factor.
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Compact 6 A automotive buck converter Delivering up to 6 A of continuous output current, the DCP0606Y from STMicroelectronics enables efficient regulation of low-voltage rails commonly used in modern vehicle electronics and industrial systems.
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[Sponsored] Instead of incrementally improving legacy Cortex-M0+ architectures, STM32C5 introduces a Cortex-M33-based platform into the entry-level category. This changes not only performance expectations, but also how engineers approach system architecture, consolidation, and long-term scalability.
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Maximising squeegee quality and durability Transition Automation has announced two new product advancements designed to improve SMT printing performance and extend squeegee life: laser-enhanced Permalex bonding and integrated edge protectors.
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NeoDen ND2 PCB screen printer The NeoDen ND2 PCB screen printing machine is a fully automatic stencil printer designed to deliver precise and consistent solder paste application in modern SMT production environments.
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Understanding the BGA rework process BGA rework is a highly technical process that involves removing the faulty component, preparing the circuit board, and installing a new or repaired device, while maintaining the integrity of the printed circuit board.
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