The current war in Iran has highlighted one critical observation: electronic engineers are shaping the future of defence and in modern warfare, superiority is no longer measured in firepower, but rather in processing power.
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RS South Africa announced that it has been named Master Distributor for the Arduino UNO Q SBC platform across South Africa and the broader African region.
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Wireless connectivity is no longer a supporting technology, but rather, a core design consideration that underpins modern electronic systems across industries.
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Phoenix Contact has expanded its safety portfolio with the new PSR-MC35-EXI safety relay module, specifically engineered for use in potentially explosive environments.
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To maintain reliable electrostatic discharge control, regular testing and accurate measurement are essential, with grounding products and ESD testing equipment being vital.
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Dizzy Enterprises recently hosted two hands-on Proteus Training Conferences, bringing together electronics professionals, designers, and enthusiasts to explore the latest capabilities of the Proteus Design Suite from Labcenter Electronics.
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TDK Corporation has jointly developed a prototype of a reservoir AI chip using an analogue electronic circuit that mimics the cerebellum with Hokkaido University.
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Designed for engineers, researchers, and radio enthusiasts alike, the HackRF Pro can transmit and receive signals across a wide frequency range of 100 kHz to 6 GHz, making it a versatile tool for testing and developing modern and emerging radio technologies.
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The Fraunhofer Institute for Photonic Microsystems IPMS has developed a new 10G TSN endpoint IP Core, enabling deterministic real-time communication at data rates of up to 10 Gbit/s.
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Choosing the right battery is not simply a technical detail, but a defining factor in the longevity and cost-effectiveness of any IoT deployment.
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Axon NPU powers smarter edge The nRF54LM20B from Nordic Semiconductor is an ultra-low-power wireless SoC that combines advanced edge AI capabilities with robust radio connectivity and rich peripheral support.
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Compact edge platform for AI Built around the Qualcomm QCS6490 octa-core SoC, Quectel’s QuecPi Alpha delivers up to 12 TOPS of on-device AI performance.
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Rugged AI PC for industry Designed to operate where conventional systems fall short, the TB-7145-MVS compact industrial PC supports advanced machine inferencing, real-time data handling, and high-performance graphics workloads without compromise.
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Reliable isolation for modern networks The Pro-Tek5 PTI Series delivers reinforced 5 kV Ethernet isolation for applications that demand robust protection, reliable signal integrity, and full IEEE802.3 performance.
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Compact cellular IoT SiP with GNSS Combining low-power connectivity, edge processing, and positioning capabilities in a compact module, Nordic’s nRF9151 targets applications such as asset tracking, smart metering, industrial monitoring, and smart city infrastructure.
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Enabling the next generation of high-performance wireless designs Espressif Systems has expanded its wireless connectivity portfolio with the introduction of the ESP32-E22, a high-performance connectivity co-processor designed for next generation embedded and IoT systems.
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High-precision smart reflow oven platform The Aurora Reflow Oven Platform from BTU International is a next generation thermal processing system engineered for modern electronics manufacturing environments.
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Yamaha extends surface-mount software toolkit The new tool, Print Param Decision Assist, automatically inspects the board file when loaded to calculate ideal printing parameters and troubleshoot existing settings.
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