EYKON is the new company name of Landis+Gyr EMEA, formerly part of the Landis+Gyr Group. The company supports electricity, gas, water and thermal utilities in managing increasingly complex networks, improving operational efficiency and enabling more sustainable use of resources.
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Mycronic’s BA 01 small dot ejector delivers unmatched precision in solder paste jet printing for advanced PCB designs.
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Yamaha Robotics will show visitors to EFX 2026, the Expo for Electronics Manufacturing, in Stuttgart from 6-8 October 2026, how advanced surface-mount automation helps companies grow their business and increase productivity.
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Choosing between the FRDM i.MX 93, FRDM i.MX 91 and FRDM i.MX 91S development platforms can be intimidating, but once designers understand how each platform aligns with their application’s requirements, the decision becomes straightforward.
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The Renesas RZ/G3E MPU is a high-performance microprocessor designed to enable advanced HMI systems with integrated artificial intelligence capabilities at the edge.
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The new line of VITA 93 QMC mezzanine modules, from Acromag, are engineered to meet increasing demands for smaller form factors and more performance.
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The EPIC-BTS9 from AAEON, is tailor-made to bring unprecedented performance to smart manufacturing and industrial robotics.
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The VL53L9 from STMicroelectronics is the first direct Time-of-Flight (dToF) 3D LiDAR all-in-one module in ST’s portfolio, offering a resolution of 2,3K zones, wide field of view, on-chip processing, 100 frames per second, and sensing range from 5 centimeters to 9 meters.
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Würth Elektronik introduces its new WE-SFIA series of flat-wire inductors in 2010, 2013, and 2016 packages.
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The PI series 3D SPI from Mycronic, measures paste volume with extreme precision and gives highly accurate SPI data, combined with a range of smart auto-programming functions that ensure high-quality inspection regardless of operator experience.
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Compact MCU for IoT endpoints Quectel’s FCM266D combines single-band 2,4 GHz Wi-Fi 6 with Bluetooth LE 5.4 in an ultra-compact LCC package measuring just 20 x 18 x 2,4 mm.
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Advanced X-ray inspection systems The Scienscope AXl-6100 series comprises specialised X-ray inspection systems explicitly engineered for the examination of long circuit boards.
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Compact all-in-one placement machines Introducing the CLT-FG, a new series of compact all-in-one SMT placement machines
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High performance RF signal conditioning The AM3269 from Mercury Systems is a high-performance RF preselector module designed to improve receiver sensitivity and signal integrity in demanding electronic warfare, signals intelligence, test, and communications applications.
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Precision power for electronics testing The PeakTech 6168 switching power supply is a versatile and reliable solution designed for professional applications in laboratories, development environments, service centres, and training facilities.
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Compact switch for 5G applications The Qorvo QPC6188 is a high-performance absorptive SP4T RF switch designed to meet the demanding requirements of modern wireless infrastructure and high-frequency communication systems.
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Nordic expands nRF Cloud with firmware vulnerability scanning nRF Cloud identifies vulnerabilities in firmware and shows exactly which deployed devices are affected, empowering device manufacturers to address EU Cyber Resilience Act requirements.
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Next-gen smart module powers intelligence at the edge Quectel Wireless Solutions has expanded its smart module portfolio with the SH803FD, a new-generation, high-performance smart module.
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