All members of Clare's line card access switch (LCAS) family are now offered in space-saving micro leadframe packages (MLP). Designers can now achieve new benchmarks in line density and realise system cost savings for both traditional voice and integrated voice-data (IVD) line cards found in central office (CO) and digital loop carrier (DLC) communications equipment.
The MLP is a near chip scale package (CSP) that offers line card designers significant area savings compared to traditional package types. It is a leadless package where electrical connections are made through lands on the bottom surface of the component. Compared to the 191 mm2 area of the CPC7583 product in a 28-pin SOIC package, the 28-pin MLP version has a footprint of only 77 mm2. This translates to an area savings of 60%. In addition, the small height of the MLP at only 0,9 mm offers a 65% reduction and gives designers the freedom to place parts on the back side of circuit boards.
Since the CPC7583 replaces three 2-Form-C electromechanical relays (EMRs), the area comparisons are equally dramatic. Even when compared to fourth generation EMRs, the MLP offers a 65% reduction in area and an 80% reduction in height. This represents another key advantage for silicon solutions in addition to lower power, improved reliability, improved airflow and reduced impulse noise.
Clare's families of LCAS products have low, matched on-resistance enabling high longitudinal balance, integrated zero-cross switching to reduce impulse noise, ultra-low power consumption of 10 mW and tertiary protection features including current limiting, thermal shutdown and SLIC protection.
For more information contact Les Bidgood, Arrow Altech Distribution, 011 923 9600, [email protected]
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