StarFabric bridge chip designed for next-gen comms

29 January 2003 Telecoms, Datacoms, Wireless, IoT

StarGen, a fabless semiconductor company, has launched the StarGen SG3010 TDM-to-StarFabric bridge. This device enables connection of TDM devices including DSPs, framers, and voice processors as well as the H.110 TDM bus directly to the StarFabric serial switch interconnect.

This highly scalable, high-capacity device is suited for such next-generation applications as voice over Internet protocol (VoIP) gateways, voice over broadband (VoB) systems, wireless base stations, and other high-density communications network equipment.

StarFabric is an industry open technology, with royalty-free licensing available through membership in the StarFabric Trade Association ( www.StarFabric.org).

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