Design Automation


RF system design software

21 March 2012 Design Automation

Agilent Technologies announced the latest release of its low-cost software for RF and microwave board design - Genesys 2012. The updated software provides enhancements in RF system simulation (including electromagnetic, circuit and statistical simulation), plus features to help designers improve the reliability of their systems.

Genesys 2012 simplifies analysis of RF systems with multi-stage conversions that enable system architects to easily visualise spurious signals across a broad frequency sweep.

Along with its unique root cause analysis capabilities, the software now gives RF system designers the power to quickly determine the source and path of spurious frequencies across the entire frequency range of the system. This enables efficient troubleshooting of the system architecture and frequency plan during system design, before hardware implementation. That, in turn, eliminates costly hardware rework during system integration.

Genesys 2012 is the result of customer feedback obtained during a lengthy early access program involving a large number of users. The feedback guided development of the software, resulting in useful features such as a configurable auto-save function to protect Genesys designs from computer or network failures.

The 2012 release delivers significant improvements to the planar EM simulator Momentum GXF, including a quadrangle mesher to efficiently mesh a planar layout with the fewest number of unknowns. It also provides a one-click link to Agilent’s EMPro software for immediate full 3D EM simulation without having to redraw the structure, assign material properties or port locations. Monte Carlo statistical analysis results can now be exported into a spreadsheet for further analysis and reporting.

For more information contact Andrew Hutton, RF Design, +27 (0)21 555 8400, [email protected], www.rfdesign.co.za



Credit(s)



Share this article:
Share via emailShare via LinkedInPrint this page

Further reading:

X-band radar
RF Design Editor's Choice Telecoms, Datacoms, Wireless, IoT
X-band radar systems, particularly those leveraging beamforming ICs (BFICs), advanced gallium nitride (GaN) and gallium arsenide (GaAs) components, are leading the way in providing the high-performance radar capabilities required for modern defence and surveillance.

Read more...
GNSS antenna redefining what’s possible
RF Design Telecoms, Datacoms, Wireless, IoT
u-blox has achieved what was once thought impossible with the launch of the DAN-F10N, the industry’s smallest and most reliable L1, L5 dual-band GNSS antenna module.

Read more...
u-blox expands NORA-B2 BLE modules
RF Design Telecoms, Datacoms, Wireless, IoT
The new nRF54L chipset-based wireless modules reduce current consumption and double processing capacity, catering to diverse mass market segments.

Read more...
MPLAB PICkit Basic
ASIC Design Services Design Automation
To make its robust programming and debugging capabilities accessible to a wider range of engineers, Microchip Technology has launched the MPLAB PICkit Basic in-circuit debugger.

Read more...
New GNSS passive patch antenna
RF Design Telecoms, Datacoms, Wireless, IoT
The HP24510A from Taoglas is a stacked patch GNSS passive antenna that operates from 1215 to 1610 MHz covering the L1/L2 GNSS spectrum.

Read more...
Accelerating RF PCB design in a 5G world
ASIC Design Services Editor's Choice Design Automation
Billions of IoT devices coming online in the coming years will require RF design capabilities that support ultra-fast 5G speeds.

Read more...
6 – 18 GHz driver amplifier
RF Design Telecoms, Datacoms, Wireless, IoT
The QPA0022D from Qorvo is a high-performance driver amplifier covering a range of 6 to 18 GHz and fabricated on Qorvo’s production 0,15 µm pHEMT process.

Read more...
NECTO Studio has been updated
Design Automation
NECTO Studio V7.1 IDE from MIKROE now includes full programmer and debug support for Microchip tools and also adds support for Microchip’s SAM MCU and STMicroelectronics’ STM32L4 series of ultra-low-power MCUs.

Read more...
3,75 GHz RF inductor
RF Design Passive Components
The ceramic chip wire wound inductor from Coilcraft features a DC resistance of 1 O, a DC current of 175 mA, and a self-resonant frequency of 3,75 GHz.

Read more...
IoT in a Box
RF Design Telecoms, Datacoms, Wireless, IoT
RAKwireless and Datacake have collaborated on a solution called ‘Real IoT in a Box’ to address the complexities of deploying IoT solutions, particularly when it comes to LoRaWAN.

Read more...