Thermal interface

8 June 2011 Circuit & System Protection

Bergquist has added Gap Pad VO Ultimate to its range of highly conformable thermal interface materials, providing high thermal conductivity of 1,3 W/m-K.

Gap Pad VO Ultimate is easily compressed, having a Young modulus of 90 kPa, thereby minimising pressure on components and providing low-stress vibration damping. Its high conformability ensures excellent interfacing and wet-out characteristics even when surfaces have high roughness or uneven topography. The rubber coated fibreglass carrier of Gap Pad VO Ultimate eases handling and provides high puncture, shear and tear resistance. Its slight inherent tack minimises shifting during assembly.

High electrical insulation, characterised by dielectric breakdown voltage of 6000 V a.c., allows use in applications requiring isolation between heatsinks and high-voltage devices. These include power supplies, telecom and networking boards, computers and peripherals, and any area where heat must be transferred from a heat-generating component to a heatsink or chassis.

Gap Pad VO Ultimate is offered in standard thicknesses from 0,508 mm to 3,175 mm, and is available in 203 x 406 mm standard sheets or as die-cut parts. Custom thicknesses are also available upon request.

For more information visit www.bergquistcompany.com

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