LGA scalable modules for M2M
29 April 2009
Telecoms, Datacoms, Wireless, IoT
Cinterion Wireless Modules has announced the availability of its new land grid array (LGA) M2M modules – the EES3, EGS5, EGS3 and BGS3.
The new modules are optimised for size and performance and feature solderable LGA surface mount technology for efficient, fully automated manufacturing and process consistency. The new LGA series modules are part of Cinterion’s Evolution Platform modules, which offer scalability, a broad range of specialised features, a compact footprint and compatibility with existing products for full design flexibility. All Evolution Platform LGA series modules are fully type approved.
As with all Cinterion Evolution Platform modules, the new LGA series features an advanced ARM9 processor design combined with the field-proven Cinterion M2M software stack. The latest silicon chip technology enables high performance and improved efficiency along with the benefit of long-term availability.
The EES3 is one of the smallest EDGE modules in the world, allowing the fastest transmission in GSM standards. It features an integrated TCP/IP stack over AT, serial and USB ports, and a RIL driver for Microsoft Windows Mobile 6.1 based devices.
The EGS5 features embedded JAVA processing based on a state-of-the-art ARM 9 processor architecture. Other features include GPRS Class 12 functionality, an integrated TCP/IP stack over AT, and an array of industrial interfaces such as SPI, I C bus, USB, A-D/D-A converter and multiple GPIOs.
The EGS3 offers enhanced M2M connectivity with GPRS Class 12 functionality, an integrated TCP/IP stack over AT as well as industrial interfaces SPI, I C and USB port.
The BGS3 features basic M2M functionality with GPRS Class 10 functionality, two serial interfaces, an integrated TCP/IP stack over AT and an RIL driver for Windows Mobile 6.1 based devices.
Cinterion has designed the LGA modules with a layout for heat dissipation that prevents warpage. Customisable soldering provides customers with the freedom to select the best soldering paste for each individual application, while optimised pad size and layout enables customer specific overprinting.
For more information contact Cinterion Wireless Modules, +27 (0)11 589 8011, [email protected], www.cinterion.com
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