RF Micro Devices has announced the introduction of its patent pending MicroShield Integrated RF Shielding technology. This technology is said to eliminate the need for bulky and costly external shields by integrating RF shielding directly into the RF IC or module. In doing so, it can reduce the height and volume requirements for RF sections by up to 25% and 50%, respectively, and provides customers with components that are insensitive to board placement.
RF shielding reduces emissions related to electromagnetic interference (EMI) and radio frequency interference (RFI) and minimises susceptibility to external fields. Traditional RF shielding is implemented with external metal 'cans' that encapsulate and shield the RF section of a circuit board. However, this implementation is costly and time consuming, as the cans used for RF shielding must be customised according to individual circuit boards. Additionally, external RF shields increase the space requirements for RF sections and, more significantly, can degrade the performance of the underlying RF circuitry. This performance degradation leads to a time-consuming retuning process that is necessary to counter the effects of the external shield.
MicroShield technology reduces the impact of EMI and RFI by minimising exposure to external fields and preventing energy leakage into unwanted areas of the host device. Also, by eliminating sensitivity to board placement, it eliminates the risk of circuit retuning, thereby accelerating time-to-market and reducing the cost of RF implementation.
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