Said to be the industry's first module that integrates the complete dual-band front-end circuitry for wireless LAN devices in a package measuring only 5,4 x 4,0 x 1,4 mm, has now been unveiled. Combining two diplexers, two receive filters, two transmit filters and one antenna diversity switch in a single component, the new R005 module from Epcos is targeted at wireless LAN chipsets to IEEE standard 802.11 b/g/a operating in the frequency bands from 2,4 to 2,5 GHz and from 4,9 to 5,9 GHz.
This breakthrough in integration and miniaturisation is the result of EPCOS' expertise in low-temperature co-fired ceramic (LTCC) technology. EPCOS offers various front-end types in its new family of WLAN modules. With footprints of 5,4 x 4 mm, 6,7 x 5,5 mm and 8,5 x 5 mm, they are compatible with leading WLAN chipsets and offer optional functions such as integrated baluns and directional couplers for RF power monitoring.
Wireless local area networks permit fast and economical configuration of private networks, connecting terminals with each other and the Internet at data rates up to 54 Mbit/s. As the share of WLAN-enabled notebooks, PDAs and mobile terminals keeps growing, integrated front-end modules save considerable board space, simplify circuit design and cut costs in comparison with today's discrete solutions. Further customer benefits common to the WLAN and GSM module lines are increased functionality, high reliability, shorter development times and minimum component count in the end product.
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