Actel has announced a new line of field-programmable gate arrays (FPGAs) targeted specifically at the automotive market. Characterised for operation from -40°C to 125°C ambient temperature and up to 150°C junction temperature (some of the highest temperatures among competitive FPGA solutions), the initial offering includes all members of Actel's eX family with plans to extend the automotive line to also include the company's MX and SX-A families.
Actel's automotive FPGAs enable designers to use programmable logic for their traditionally low-density application-specific integrated circuit (ASIC) requirements. The new automotive products are well suited to in-cab control and interconnect functions for a range of telematic applications, such as navigation, speech recognition, control/comfort systems, passenger monitors and heads-up displays.
"The introduction of our new automotive eX FPGAs is a timely one, as the design benefits of programmable logic solutions address the growing demand for more advanced, more converged in-cab applications," said Barry Marsh, vice president of product marketing at Actel Corporation. "Further, with the acknowledged benefits of our single-chip, nonvolatile technologies in combination with our long history of delivering highly reliable solutions, Actel's automotive products deliver the features and small package flexibility automotive customers need to speed time to market without compromising cost or performance while offering improved quality and durability for in-cab automotive systems."
Actel's automotive eX family includes three products, the eX64A, eX128A and the eX256A, and is available in 2,5 or 3,3 V operating modes. Customers also have available a broad portfolio of IP specifically designed and optimised for in-cab automotive applications. Initially, Actel's partners Memec Design, Amphion, CAST, and Inicore, will offer more than 30 IP cores for Actel's automotive solutions, including: CAN, I2C interface, SPI, Z80CPU, MC-ACT-6809 CPU, Reed Solomon and DES/3DES/AES. Pre-designed IP helps reduce design time and provides the ability to integrate multiple design elements into a one-chip solution, reducing an application's component count and cost.
For more information contact Kobus van Rooyen, ASIC Design Services, 011 315 8316, [email protected]
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