Lowest on-resistance RAD-hard P-channel MOSFETs 9 May 2001 New 30, 60, 100 and 200 V P-channel R5 RAD-Hard MOSFETs from International Rectifier have an average of 24% lower device on-resistance and 81% lower gate charge than similar products in the radiation-hardened ...
Cap-free, linear regulators provide low dropout and low noise 9 May 2001 The Burr-Brown REG10x family of cap-free, low-noise, ultra-low dropout linear regulators (LDOs) from Texas Instruments offers 100 mA to 1 A output without the requirement of capacitors or external supplies.
The ...
Load share controller eliminates 'OR'ing diodes for N+1 redundant supplies 9 May 2001 Linear Technology introduces the LTC4350, a controller that allows the load current to be equally shared among multiple power supplies. By using isolation FETs and very low value sense resistors, it provides ...
Power factor correction solution meets new EMC directive 9 May 2001, Altron Arrow, EBV Electrolink Intersil claims to have developed a simple and efficient solution to meet the recently-approved European standards for boost power factor correction (PFC) of power supply standards at low cost. Intersil ...
5 W surface mountable DC-DC converter 9 May 2001, Vepac Electronics Interpoint offers the MSM series of DC-DC converters delivering up to 5 W from a 28 V input in a surface mountable package. Mature design technology incorporated in the series maintains high-reliability, ...
Solderable profiled heatsinks 9 May 2001, Sivan Electronic Supplies Alutronic offers lightweight aluminium profiled heatsinks with multipoint solder fixing feet for assembly in a dip soldering bath.
The pre-tinned solderable punched/bent parts with twin soldering pins ...
125 W DC-DC converter with built-in EMI filter 9 May 2001, Vepac Electronics Interpoint's MSS Series family of DC-DC converters features a built-in EMI filter which meets the requirements of MIL-STD-461E, CE102 (no external components required); an output that can be adjusted ...
Power devices in MiniBLOC package 25 April 2001 Ixys' Power MOSFET family, the IXKN40N60C in SOT 227B package, is suitable for switching frequencies above 250 kHz. Besides the optimised switching behaviour the CoolMos transistor typically has a very ...
IGBT modules in SKiiP technology 28 March 2001, Electrocomp Semikron developed its SKiM product range in joint cooperation with important international customers of power electronics. It says that this ensures global compatibility of the modules and fulfils the ...
New chip architecture increases DC-DC conversion efficiency 28 March 2001 International Rectifier has introduced iPOWIR technology, which it claims is a whole new way to design on-board DC-DC converters for computing and communications equipment.
Power demands for digital ...
Ultra-low voltage power management chip 28 March 2001, Altron Arrow At the Wireless Portable Symposium & Exhibition, ON Semiconductor announced the NCS2001, an addition to its sub-1 volt integrated circuit family. The NCS2001 is a low power, rail-to-rail input and output ...
Isolated TO-220 style plastic package increases power density 28 March 2001 IXYS introduced a new plastic encapsulated package in the 'hole-less' TO-220 outline with an electrically isolated mounting tab. Existing packages with internal isolation involve bonding an insulator ...
Radiation hardened power-up reset circuit 28 March 2001, Altron Arrow Intersil's new radiation hardened power-up microprocessor reset circuit, the IS-705RH, is the latest edition to the growing family of Star*Power products. It is designed to monitor power supply voltage ...
1200 W front-end power supplies support current-sharing and hot-swapping 14 March 2001, Vepac Electronics Artesyn Technologies has launched a new family of 1200 W front-end AC/DC power supplies featuring a particularly extensive set of configuration and control facilities to simplify system integration and ...
Selecting electrolytic capacitors for power supplies 28 February 2001, Electrocomp In a power supply it is not possible to consider only ambient temperature for lifetime calculations as factors such as self-heating become a significant part of the calculations
Thermal sink for D3 PAK SMT case 28 February 2001, Actum Electronics Aavid's D3 PAK thermal solution allows circuit designers to decrease the device case temperature by 17°C at 2 W power dissipation or increase the maximum power handling capability of the device by 1 W ...
Automated web-based DC-DC converter design system 28 February 2001 VDAC (Vicor Design Assistance Computer) is a innovative new system which enables Vicor's customers to specify on-line, and verify in realtime, the performance and attributes of 'custom' 2nd Generation ...
Cut cores available 28 February 2001 Magnetics, a division of Spang & Co manufactures cut cores which it says is ideal for applications where low core loss is needed and core saturation is undesirable: * Supermendur (50 Co/50 Fe) C and ...
Hot swap controller for 3,3/5 V compact PCI applications 28 February 2001 Linear Technology's LTC1646 is a CompactPCI hot swap controller that allows cards to be safely inserted or removed while the system is running. The LTC1646 directly controls the 3,3 and 5 V supplies for ...
