Aavid's D3 PAK thermal solution allows circuit designers to decrease the device case temperature by 17°C at 2 W power dissipation or increase the maximum power handling capability of the device by 1 W (over that achievable without an added heatsink solution in 100 LFM forced airflow cooling environment).
Made of high conductivity copper, a coating of 63/37 tin/lead solder makes attachment easy in any surface mount process. Aavid designs all parts with a flat surface suitable for automated assembly using standard vacuum pick-and-place equipment.
Aavid says its surface mount thermal solutions offer a 30% improvement in thermal resistance from case-to-ambient.
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