5 October 2016Telecoms, Datacoms, Wireless, IoT
DSP, Micros & Memory
Expanding the functionality of Internet of Things (IoT) networks, Texas Instruments announced availability for mass production of the industry’s lowest-power dual-band wireless microcontroller (MCU) supporting sub-1 GHz and Bluetooth low energy connectivity on a single chip. As part of TI’s pin-to-pin and software compatible SimpleLink platform, the new CC1350 enables developers to move from a three-chip solution to a tiny single chip, while reducing design complexity and saving power, cost and board space. The wireless MCU offers a range of up to 20 km on a coin cell battery for building and factory automation, alarm and security, smart grid, asset tracking and wireless sensor network applications.
Module combines 5G and NTN support Quectel Wireless Solutions
Telecoms, Datacoms, Wireless, IoT
Quectel Wireless Solutions announced the launch of its BG770A-SN ultra-compact 5G-ready satellite communication module, compliant with 3GPP releases 13, 14 and 17.
Read more...Scalable and secure IoT device onboarding and management
Telecoms, Datacoms, Wireless, IoT
EasyPass is an enhancement within Cambium’s cnMaestro platform, aimed at providing local businesses with secure, efficient, and scalable device management, making it ideal for high-demand environments such as educational institutions, retail spaces, and corporate campuses.
Read more...SIMCom’s A7673X series Otto Wireless Solutions
Telecoms, Datacoms, Wireless, IoT
SIMCom’s A7673X series is a Cat 1 bis module that supports LTE-FDD, with a maximum downlink rate of 10 Mbps and an uplink rate of 5 Mbps.
Read more...Powering the intelligent edge EBV Electrolink
AI & ML
STMicroelectronics released new devices from the second generation of its industrial MPUs, the STM32MP2 series, to drive future progress in smart factories, smart healthcare, smart buildings, and smart infrastructure.
Read more...Non-terrestrial network module Altron Arrow
Telecoms, Datacoms, Wireless, IoT
Fibocom unveiled its MA510-GL (NTN), a non-terrestrial networks module which is compliant with 3GPP Release 17 standard.
Read more...QLC Flash memory using BiCS tech EBV Electrolink
DSP, Micros & Memory
KIOXIA announced it had started shipping its 2 Tb Quad-Level-Cell memory devices with its 8th-generation BiCS FLASH 3D flash memory technology.
Read more...Cellular IoT connectivity via satellite Altron Arrow
Telecoms, Datacoms, Wireless, IoT
The Telit Cinterion cellular LPWA module will enable satellite data communication using the NB-IoT protocol, without any special hardware changes required for the integration of the cellular module in the customer application.
Read more...Integrated POL voltage regulators EBV Electrolink
Power Electronics / Power Management
Infineon’s TDA38807 and TDA38806 are their highest density high-efficiency integrated point-of-load (IPOL) solutions for smart enterprise systems.
Read more...Wireless module supports up to 600 Mbps iCorp Technologies
Telecoms, Datacoms, Wireless, IoT
Quectel’s FCU865R is a high-performance Wi-Fi 6 and Bluetooth 5.3 LCC package module which can be used for WLAN and Bluetooth connections.
Read more...Unlocking the future of connectivity
Telecoms, Datacoms, Wireless, IoT
The battle for the 6 GHz spectrum band is heating up in South Africa, mirroring global debates on the allocation of spectrum between Wi-Fi and cellular operators.
printer friendly version