ASMPT’s SIPLACE TX seamlessly integrates into the company’s intelligent factory concept through standard interfaces and a growing number of automation options.
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Absolute precision and maximum performance have made ASMPT’s SIPLACE X S the placement platform of choice for demanding high-volume production applications.
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Soldering with wire and iron leaves process judgments up to individual operators, and can produce a wide variety of defects, scrap, or long-term quality issues.
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The DEK TQ printing platform is superfast, with a core cycle time of only 5 to 6,5 s, and provides outstanding flexibility.
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The SIPLACE SX is a leading placement platform for high-mix electronics production, where even odd-shaped components can be placed with exceptional reliability.
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