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The TLV493D-A1B6, a new magnetic sensor from Infineon Technologies, offers accurate three-dimensional sensing with extremely low power consumption in a small 6-pin package.
With its magnetic field detection
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Infineon Technologies’ new OPTIGA TPM (Trusted Platform Module) with SPI (serial peripheral interface) has achieved Common Criteria Certification EAL4+, enabling system manufacturers and users to distinguish
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Infineon Technologies has provided further details on its recently announced roadmap – which it dubbed 'The Answer' – for the ongoing future development of high-power IGBT technology. Elaborating on its
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Power modules have proven to be the driving force behind the rapid development in the area of power electronic systems technology, particularly in terms of energy savings, control dynamics, noise reduction
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Infineon Technologies extended its OptiMOS 5 portfolio with 80 V and 100 V variants optimised for high switching frequencies such as in synchronous rectification applications for telecom and server power
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The International Electrotechnical Commission (IEC) has introduced the IEC60730 safety standard for household appliances. For microcontroller systems, the IEC60730 Annex H defines the details of tests
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Infineon Technologies extended its OptiMOS 5 portfolio with 80 V and 100 V variants optimised for high switching frequencies such as in synchronous rectification applications for telecom and server power
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Infineon Technologies has introduced a new generation of HybridPACK power modules for electric vehicle drives to follow up the worldwide deployment of the first two generations in quantities numbering
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To satisfy the evolving demands that requirements such as increased energy efficiency place on current sensing technologies in systems ranging from solar inverters and electric drives, server and telecom
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Automation engineers face new challenges as their tasks become ever more complex. Expectations regarding productivity, profitability, flexibility and the length of innovation cycles are becoming higher.
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NFC transforms a mobile device into a platform for applications that will massively enhance consumers’ experiences when using their smartphones and related portable devices.
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SiC (silicon carbide) power devices are enabling components, mainly in the context of higher switching frequencies and/or small footprints in power electronics.
However, this trend imposes new challenges
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