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IPC revises terminology standard
22 February 2012, News

For those looking to get a handle on commonly used electronics industry acronyms and terminology, IPC has released IPC-T-50J: Terms and Definitions for Interconnecting and Packaging Electronic Circuits. ...
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Surface mount placement characterisation standard revised
8 February 2012, News

The comparison provided by the standard shows how machine speeds change as accuracy requirements rise
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IPC updates PCB cleaning guidelines
17 August 2011, News

The 200-page document not only brings cleaning requirements up to date, it also combines multiple documents into a single, comprehensive guideline
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Guidelines for BTC assembly
25 May 2011, News

This standard describes the critical design, assembly, inspection, repair and reliability issues associated with bottom termination components
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Pad cratering test standard
11 May 2011, News

Over the past few years, pad cratering has become a vexing problem in lead-free assemblies, largely attributed to problems with the resin used to make a printed circuit board. To help industry eliminate ...
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IPC updates popular standards
2 February 2011, News

IPC has released the training and certification programmes for revision E of IPC-A-610 ‘Acceptability of Electronics Assemblies’ and J-STD-001 ‘Requirements for Soldered Electrical and Electronic Assemblies’. ...
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IPC delivers PCB handling standard
29 September 2010, News, Manufacturing / Production Technology, Hardware & Services

IPC-1601 provides users with guidance on how to protect printed boards from contamination, physical damage, solderability degradation, electrostatic discharge and moisture uptake
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Land pattern standard updated
18 August 2010, News

IPC has released the B revision of IPC-7351 ‘Generic requirements for surface mount design and land pattern standard'
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