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For those looking to get a handle on commonly used electronics industry acronyms and terminology, IPC has released IPC-T-50J: Terms and Definitions for Interconnecting and Packaging Electronic Circuits.
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The comparison provided by the standard shows how machine speeds change as accuracy requirements rise
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The 200-page document not only brings cleaning requirements up to date, it also combines multiple documents into a single, comprehensive guideline
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This standard describes the critical design, assembly, inspection, repair and reliability issues associated with bottom termination components
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Over the past few years, pad cratering has become a vexing problem in lead-free assemblies, largely attributed to problems with the resin used to make a printed circuit board. To help industry eliminate
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IPC has released the training and certification programmes for revision E of IPC-A-610 ‘Acceptability of Electronics Assemblies’ and J-STD-001 ‘Requirements for Soldered Electrical and Electronic Assemblies’.
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IPC-1601 provides users with guidance on how to protect printed boards from contamination, physical damage, solderability degradation, electrostatic discharge and moisture uptake
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IPC has released the B revision of IPC-7351 ‘Generic requirements for surface mount design and land pattern standard'
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