For those looking to get a handle on commonly used electronics industry acronyms and terminology, IPC has released IPC-T-50J: Terms and Definitions for Interconnecting and Packaging Electronic Circuits. The J revision contains nearly 400 new or revised terms, including terminology for chip scale and area array packaging, cable and wire harness technology, semiconductor packaging, assembly processing, moisture sensitive components and microvia technology.
The terms and definitions within the standard are written to provide clarity of detail, so that a reader utilising English as a second language can understand the subtleties of the meaning of each term. The latest revision takes the mystery out of haloing, head on pillow, mouse bites, pad cratering, moisture/reflow sensitivity classification and other terms.
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