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The US Air Force projects it will turn a small $485 000 investment for four PinPoint II Testers, from DiagnoSYS, into $13-plus million in cost avoidance to re-host more than 100 previously developed software
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This article describes the process of reworking BGA or CSP components when lead-free solder is being used.
Basically, the steps to remove and replace BGA/CSPs are straightforward: 1. Establish thermal
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This document was commissioned by Vision Engineering, world leaders in the development and manufacture of stereo optical inspection systems. The report explains the basic assembly process for modern printed
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When it comes to reworking BGAs, CSPs, land grid arrays (LGAs), micro SMDs, micro-lead frames (MLFs) and bumped chip components, an important key to success is vision: the ability to see, align and accurately
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Visionics has released the Edwin XP Version 1.20 EDA package. This EDWin (electronic design for windows) release features: schematic capture, advanced EdSpice and mixed-signal circuit simulation, PCB
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Metcal's innovative VPI-1000 optical inspection system adds features and flexibility to traditional optical inspection while offering customers an economical inspection solution. According to the company,
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When it comes to reworking sophisticated array packages, no other company has achieved Metcal's level of global success. Its soldering/desoldering stations and BGA/CSP rework equipment sets the standard
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Metcal claims its versatile APR-5000 Array Package Rework System offers the repeatability, accuracy and thermal control essential for the safe and effective rework of today's leading-edge BGA, CSP, land
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When it comes to reworking sophisticated array packages, no other company has achieved Metcal's level of global success. Its soldering/desoldering stations and BGA/CSP rework equipment sets the standard
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The Mantis viewing system bridges the critical gap between the microscope and bench magnifier.
Vision Engineering's unique and patented spatial imaging system meets the demands of higher magnification,
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It is trite to speak of smaller, faster, cheaper, better. Each is a given in today's electronics manufacturing environment. If anything, the current downturn has accelerated miniaturisation and further
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Metcal's new range of micro fine rework tips are designed to make it easier for operators to rework miniature components such as 0402s and 0201s on compact, high density boards.
The range includes:
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