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The MXI system X8011 PCB, constructed by Viscom in Germany and sold worldwide for many years, has undergone a thorough revision. The company premiered the result, the X8011-II PCB, alongside other systems
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Indium announced the release of PoP Flux 89LV-P, a bright pink-coloured, no-clean, thixotropic flux that helps engineers to ‘avoid the void’ by greatly improving visual inspection to minimise voiding
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The peelable solder masks of the series PSM 13.990 are designed to be applied in limited zones on printed circuit boards (PCB) in order to protect them from direct contact with solder. These ELPEGUARD
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QA Technology has added two new serrated tip styles in a variety of conventional and X Probe Socketless Series products. The new 49 and B9 serrated tip designs are for contacting pasted pads with dome
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Chinese SMT screen printer manufacturer GKG’s GL Series, the most popular in its range, is designed for printed circuit boards (PCB) with a maximum size of 510 x 510 mm.
It comes standard with advanced
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The G5 vision printer from GKG, which accommodates PCBs up to 400 (L) x 310 (W) mm in size, features a rigid, stable body structure weighing in at 1000 kg and occupies 1105 x 1500 x 1400 mm of space on
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The AM100 maintains the high standards for capability, flexibility and reliability customers expect from Panasonic in a cost-effective, incrementally scalable, high-mix SMT solution. Only one machine
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The evolutionary Panasonic NPM-D3 continues in the steps of its award-winning predecessor with interchangeable dispensing, placement and inspection heads, plus new enhancements that further increase productivity.
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The continuing evolution toward advanced miniature packaging has led to ever increasing printed circuit board (PCB) density and complexity. As the manufacturing process becomes progressively more complicated,
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Indium8.9HF is an air-reflow, no-clean solder paste specifically formulated to accommodate the higher processing temperatures required by the SnAgCu, SnAg and other alloy systems favoured by the electronics
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Indium’s eutectic AuSn (gold/tin) solder is available in many forms, including wire, ribbon, preforms and solder paste. Precision wire, ribbon or preforms are produced to exact dimensions, meeting customers’
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Nordson ASYMTEK introduced the NexJet NJ-8 system which improves and simplifies the dispensing process for fast-paced production environments where precision, flexibility and long-term reliability are
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