25 November 2015Manufacturing / Production Technology, Hardware & Services
Indium’s eutectic AuSn (gold/tin) solder is available in many forms, including wire, ribbon, preforms and solder paste. Precision wire, ribbon or preforms are produced to exact dimensions, meeting customers’ precise demands. Solder paste is available in a variety of parameters to address individual needs. Solder preforms are also available in AuGe, AuSi and pure Au.
Thermal requirements often mandate a high-melting die-attach solder. With a melting point of 280°C, eutectic AuSn often satisfies these demands. The material’s compatibility with gold metallisations, coupled with its long-term reliability, also make it a good choice for high-rel applications such as microwave systems, medical and aerospace applications, and more.
AuSn’s excellent wetting properties, its relatively low melting point (when compared to certain die-attach alloys), and its long-term reliability make this alloy desirable for lid sealing applications. With a tensile strength of 275 MPa, eutectic AuSn provides an attractive alternative to brazes when high strength must be achieved at soldering temperatures.
Characteristics of this alloy include excellent joint strength and superior resistance to corrosion and superior thermal conductivity when compared to standard solders. AuSn alloy is compatible with precious metals and is RoHS compliant.
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