Otto Marketing

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Email: [email protected]
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more information about Otto Marketing

Micro Backplane Design Guide
8 February 2012, Technical Literature

The newly released Micro Backplane Design Guide highlights Samtec’s high-speed and high-density board-to-board and panel and I/O interface solutions ideal for micro backplane applications, as well as ...
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Micro Backplane Design Guide
25 January 2012, Technical Literature

The newly released Micro Backplane Design Guide highlights Samtec’s high-speed and high-density board-to-board and panel and I/O interface solutions ideal for micro backplane applications, as well as ...
read more


Sealed Mini-USB connectors
23 November 2011, Electronic Industry Supplies, Interconnection

CONEC has expanded its bayonet-locking and water-resistant series of connectors with a Mini-USB connector compliant with USB 2.0 specifications. The new connector provides design engineers with a highly ...
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Micro Backplane Design Guide
23 November 2011, Technical Literature

The newly released Micro Backplane Design Guide highlights Samtec’s high-speed and high-density board-to-board and panel and I/O interface solutions ideal for micro backplane applications, as well as ...
read more


High-density interconnects
9 November 2011, Interconnection

Samtec is continuing to evolve its line of SEARAY open pin field interconnects to support the demands of high-speed applications requiring highly reliable, high pin count solutions. The latest additions ...
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Micro Backplane Design Guide
9 November 2011, Technical Literature

The newly released Micro Backplane Design Guide highlights Samtec’s high-speed and high-density board-to-board and panel and I/O interface solutions ideal for micro backplane applications, as well as ...
read more


High-speed wireless modem
26 October 2011, Telecoms, Datacoms, Wireless, IoT

Otto Wireless Solutions has débuted the latest in its lineup of ready-to-deploy finished wireless products, the SIM5218E DUAL I/F modem. The device is an HSDPA/HSUPA (7,2 Mbps/5,76 Mbps) industrial modem ...
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Micro Backplane Design Guide
26 October 2011, Technical Literature

The newly released Micro Backplane Design Guide highlights Samtec’s high-speed and high-density board-to-board and panel and I/O interface solutions ideal for micro backplane applications, as well as ...
read more


Micro Backplane Design Guide
12 October 2011, Technical Literature

The newly released Micro Backplane Design Guide highlights Samtec’s high-speed and high-density board-to-board and panel and I/O interface solutions ideal for micro backplane applications, as well as ...
read more


High-density D-sub connectors
28 September 2011, Interconnection

Conec has expanded its range of mixed-layout D-subminiature (D-sub) connectors by introducing the new high-density range. The new offering includes 19W1, 15W4 and 45W2 configurations in both straight ...
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Micro Backplane Design Guide
28 September 2011, Technical Literature

The newly released Micro Backplane Design Guide highlights Samtec’s high-speed and high-density board-to-board and panel and I/O interface solutions ideal for micro backplane applications, as well as ...
read more


Micro Backplane Design Guide
14 September 2011, Technical Literature

The newly released Micro Backplane Design Guide highlights Samtec’s high-speed and high-density board-to-board and panel and I/O interface solutions ideal for micro backplane applications, as well as ...
read more





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