Infineon has developed a CO2 sensor chip the XENSIV PAS CO₂ sensor module that integrates a PAS transducer, a microcontroller, and a MOSFET on the PCB.
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Vishay’s recently announced high-temperature IHSR inductor delivers current ratings up to 155 A and can operate in temperatures up to 155°C.
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Vishay has released a new series of 40 V small-signal Schottky and 100 V small-signal switching diodes which are rated for a maximum junction temperature of 175°C.
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The new dsPIC33EDV64MC205 system in package (SiP) from Microchip is a compact, cost-effective solution for industrial, automotive, consumer or medical motor control applications.
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Wi-Fi is the primary connectivity technology driving the IoT and over the next ten years, Wi-Fi 6 and 6E will power the next decade of IoT. This video series provides insights into the evolving future of connectivity including Wi-Fi traffic jams, Wi-Fi 6 features, 20 MHz mode for IoT, and Wi-Fi 6/6E adoption.
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Toshiba has announced its third-generation silicon carbide (SiC) MOSFETs that deliver low on-resistance and significantly reduced switching loss.
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Infineon experts have teamed up with EBV, HighTec, Neutron Controls, PLS and Hitex to bring you the benefits of intelligent, safe automotive battery management systems (BMS).
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Infineon, in conjunction with EBV Elektronik, will host a joint webinar on how a modular reference design platform for DC EV charging systems can enable the flexibility to choose what you need to speed up your individual designs.
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The EZ-PD Barrel Connector Replacement (BCR) is Infineon's highly integrated USB Type-C port controller which seeks to replace legacy barrel connectors of up to 100 W.
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Infineon has announced a family of fixed-frequency AC/DC integrated power stages which are integrated with an avalanche rugged CoolMOS high-voltage super-junction MOSFET.
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With bidirectional charging, solar power from an installed photovoltaic system can be stored in the batteries of electric cars, and be fed back into the home electrical system when needed.
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Vishay has released a new series of ESD protection diodes with EMI filtering in an ultra-compact chip-level package.
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