Building insulation is becoming increasingly efficient in combatting the effects of climate change and in reducing the overall energy consumption. However, heavily insulated buildings are not always good news for human health.
Poor ventilation can result in lower oxygen levels and a build-up of carbon dioxide (CO2). Even moderate levels of CO2 can have a negative impact on health and productivity - at 1000 ppm, people begin to experience drowsiness and have difficulty concentrating.
Consequently, CO2 sensor module manufacturers are facing a growing demand for smart indoor air quality sensors that can sense rising levels of CO2, and either alert the user or trigger a system response. Smart home CO2 sensors enable real-time CO2 monitoring for demand-controlled ventilation systems, air purifiers, and thermostats while allowing users to accurately measure and adjust indoor air quality.
Infineon has developed a CO2 sensor chip that provides accurate, real-time CO2 measurement, thanks to superior MEMS technology. The MEMS-based CO2 sensor uses Infineon's MEMS microphone, which acts as a pressure sensor and is optimised for low-frequency operation. The XENSIV PAS CO2 sensor module integrates a PAS transducer, a microcontroller, and a MOSFET on the PCB.
There are three CO2 sensor types that are mainly used in the industry. These include PAS (photoacoustic spectroscopy) sensors, NDIR (non-dispersive infrared) sensors, and EC (electrochemical) sensors. Infineon's XENSIV PAS CO2 sensor matches the performance of NDIR and EC sensors, while being more affordable and compact, making it the ideal solution for smart home and building automation applications.
Along with size and cost advantages, the sensor delivers superior accuracy, providing a direct readout of the real CO2 level, not simply a correlation. Reliable CO2 sensor measurement enables smart monitoring of indoor air quality, allowing users to take control of their environmental conditions and experience improvements in health, productivity, and overall wellbeing.
Powering the intelligent edge EBV Electrolink
AI & ML
STMicroelectronics released new devices from the second generation of its industrial MPUs, the STM32MP2 series, to drive future progress in smart factories, smart healthcare, smart buildings, and smart infrastructure.
Read more...QLC Flash memory using BiCS tech EBV Electrolink
DSP, Micros & Memory
KIOXIA announced it had started shipping its 2 Tb Quad-Level-Cell memory devices with its 8th-generation BiCS FLASH 3D flash memory technology.
Read more...Integrated POL voltage regulators EBV Electrolink
Power Electronics / Power Management
Infineon’s TDA38807 and TDA38806 are their highest density high-efficiency integrated point-of-load (IPOL) solutions for smart enterprise systems.
Read more...UFS Flash named Best in Show EBV Electrolink
News
KIOXIA Europe GmbH was named as winner in the Memory & Storage category of the Embedded Computing Design (ECD) electronica Best in Show Awards at the recently held electronica 2024.
Read more...The power of UWB EBV Electrolink
Editor's Choice Telecoms, Datacoms, Wireless, IoT
Ultra-Wideband, the robust wireless communications technology commonly known as UWB, is such a versatile technology, capable of doing so many different things, that it can be hard to categorise.
Read more...Trimension family secures car access EBV Electrolink
Telecoms, Datacoms, Wireless, IoT
The Trimension NCJ29Dx family is part of NXP’s portfolio of secure car access system solutions, which includes the NCF3340 NFC controller and the KW37 Bluetooth 5.0 Long-Range MCU.
Read more...Entry-level MCU with classical peripherals EBV Electrolink
DSP, Micros & Memory
NXP’s MCX C04x microcontrollers feature an Arm Cortex-M0+ core up to 48 MHz and offer 32 KB Flash, 2 KB SRAM, and 8 KB boot ROM.
Read more...QLC Flash memory with the latest BiCS technology EBV Electrolink
Analogue, Mixed Signal, LSI
KIOXIA has implemented the groundbreaking CBA (CMOS directly Bonded to Array) technology, which enables the creation of higher density devices and an industry-leading interface speed of 3,6nbsp;Gbps.
Read more...Webinar: Game-changing Matter standard EBV Electrolink
Telecoms, Datacoms, Wireless, IoT
Join Infineon for an exclusive one-hour webinar with EBV Elektronik, exploring the groundbreaking Matter standard, and its profound implications for the future of smart homes.
Read more...General-purpose MCU with RISC-V architecture EBV Electrolink
DSP, Micros & Memory
Renesas has released a general-purpose MCU to enhance its existing RISC-V portfolio, and this is its first MCU using a RISC-V core developed internally at the company.
printer friendly version