Coilcraft's MSD1278H Series of high-temperature 1:1 coupled power inductors feature magnetic shielding for compact packaging and tight winding-to-winding coupling. They are ideal for flyback, SEPIC, Cuk, Zeta and other applications.
The AEC-Q200 Grade 1 (-40°C to +125°C) parts exhibit tight coupling (k ≥ 0,98), 500 Vrms, 1-minute isolation (hipot) between primary and secondary, high efficiency and excellent current handling. They can also be used as two single inductors connected in series or parallel, as a common mode choke or as a 1:1 transformer.
X-band radar RF Design
Editor's Choice Telecoms, Datacoms, Wireless, IoT
X-band radar systems, particularly those leveraging beamforming ICs (BFICs), advanced gallium nitride (GaN) and gallium arsenide (GaAs) components, are leading the way in providing the high-performance radar capabilities required for modern defence and surveillance.
Read more...GNSS antenna redefining what’s possible RF Design
Telecoms, Datacoms, Wireless, IoT
u-blox has achieved what was once thought impossible with the launch of the DAN-F10N, the industry’s smallest and most reliable L1, L5 dual-band GNSS antenna module.
Read more...u-blox expands NORA-B2 BLE modules RF Design
Telecoms, Datacoms, Wireless, IoT
The new nRF54L chipset-based wireless modules reduce current consumption and double processing capacity, catering to diverse mass market segments.
Read more...HiRel components from Kyocera AVX Electrocomp
Passive Components
Kyocera AVX Corporation is a leading supplier of advanced components and interconnect solutions, offering a broad selection of passive components and connectors.
Read more...New GNSS passive patch antenna RF Design
Telecoms, Datacoms, Wireless, IoT
The HP24510A from Taoglas is a stacked patch GNSS passive antenna that operates from 1215 to 1610 MHz covering the L1/L2 GNSS spectrum.
Read more...Tiny power inductor for low noise applications iCorp Technologies
Passive Components
With the evolution of Bluetooth, chips, sensors and other technologies, the design of TWS earphones is becoming smaller and thinner, and the performance and size requirements of integrated inductors need to follow suit.
Read more...6 – 18 GHz driver amplifier RF Design
Telecoms, Datacoms, Wireless, IoT
The QPA0022D from Qorvo is a high-performance driver amplifier covering a range of 6 to 18 GHz and fabricated on Qorvo’s production 0,15 µm pHEMT process.
Read more...3,75 GHz RF inductor RF Design
Passive Components
The ceramic chip wire wound inductor from Coilcraft features a DC resistance of 1 O, a DC current of 175 mA, and a self-resonant frequency of 3,75 GHz.
Read more...Upgraded power inductor series iCorp Technologies
Passive Components
Sunlord’s multiphase co-fired power inductor HTF-MP series has upgraded the single-phase HTF-H products in terms of integrated applications.
Read more...IoT in a Box RF Design
Telecoms, Datacoms, Wireless, IoT
RAKwireless and Datacake have collaborated on a solution called ‘Real IoT in a Box’ to address the complexities of deploying IoT solutions, particularly when it comes to LoRaWAN.
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