Silicone-free form-in-place gasketing material

12 March 2003 Manufacturing / Production Technology, Hardware & Services

Laird Technologies' non-silicone based form-in-place gasketing compound (SNNSF) is ideal for critical applications where concerns over silicone migration or contamination exist, such as in the telecommunications and automotive sectors. This proprietary compound is a one part, room temperature cure polymer with silver/nickel particles and can be dispensed onto plastic or metal enclosures in the same way other form-in-place compounds are.

The paste offers excellent adhesion to a wide range of materials. Shielding effectiveness of greater than 100 dB coupled with the low compression force of this material makes it an attractive alternative to silicone based form-in-place compounds.

* High shielding effectiveness - over 100 dB across a wide frequency range.

* One-part, room temperature cure.

* Excellent adhesion to a wide range of material substrates.

* Low compression force, similar to traditional silicone products.

* Eliminates concerns of silicone migration or contamination.

* Same cure rate as silicone products; 98% cure in 12 hours @ 50% relative humidity.

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