Aavid offers expandable collar, multiple mounting, high power TO3 heatsinks designed to save space.
Series 5791 expandable collar heatsinks have virtually the same footprint as the semiconductor cases for which they are designed no extra board space is needed. The collar expands to slip over the semiconductor easily and grips the hat to provide superior thermal contact. No extra hardware is needed.
Series 5000 is ideal for circuit board applications where space is a premium, and provides free circulation of air from all sides. It accepts semiconductor case style TO3 - other hole patterns available.
Series 5001/2/3/4 TO3 are maximum performance 1-piece heatsinks that have unique fin design for circuit board applications. The unique design uses slanted vane fins for efficient heat dissipation. Air movement from any direction is diverted into the centre of the heatsink to create turbulence and improve heat transfer. High thermal efficiency enables this lightweight heatsink to dissipate as much as heavier and more costly impact extrusions and castings. Other hole patterns are available.
Series 5013 is a space saving, low-cost series, ideal for applications with tight space requirements.
Series 5423 clamps over the TO3 case using virtually no additional board space.
Power efficiency and robustness in electronics design
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