1 January 2019
Manufacturing / Production Technology, Hardware & Services
The ZM-R6823 BGA rework system is suitable for normal SMD (BGA, QFP, etc.) and micro-SMD component repair, supporting P08 small-pitch LED beads and ICs down to 0,5 mm x 0,5 mm in size.
The station has three independent heating areas – the first and second one being hot-air, and the third one a quartz heater. It is equipped with an air distribution system from a pressurised tank, allowing the user to connect the station to a nitrogen cylinder, which gives better results by minimising contamination of the solder, as well as the effects of surface tension and voiding.
A split vision system with high magnification, adjustable freely in the XY plane, allows precise positioning of mounted components on the board, using a prism system of integrated optics. This allows the bottom of the system and its position to be previewed, relative to the board.
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printer friendly version