Medical and military applications, where a high capacitance value is required, can consider the Novacap branded MLCCs (multilayer ceramic capacitors) from Knowles Precision Devices (KPD). According to the manufacturer, comparable circuit designs can be achieved at typically a third to a fifth of the capacitance values because of the low ESR characteristics these parts exhibit.
These RoHS-compliant, high-capacitance value BME MLC chip capacitors are manufactured in stable Class II dielectrics X7R and X5R. The range is offered with a spread of capacitance values starting at 6,8 nF and topping out at 100 µF. Because of the extremely low ESR characteristics, they are ideal to replace tantalum and low-ESR electrolytic capacitors without polarity concerns.
They find application as power supply bypass capacitors, smoothing capacitors, input/output filters in DC-DC converters and in digital circuits and LCD modules. ±10% and ±20% capacitance tolerances are available, and all parts are available with high-reliability screening.
Nickel Barrier termination options include tin, tin/lead or gold flash – all suitable for reflow soldering process. The gold flash option is of particular interest to eliminate the problem of tin ‘whiskering’. This sort of failure can represent a clear and present danger, especially to Hi-Rel applications such as medical implantable devices and military equipment.
X-band radar RF Design
Editor's Choice Telecoms, Datacoms, Wireless, IoT
X-band radar systems, particularly those leveraging beamforming ICs (BFICs), advanced gallium nitride (GaN) and gallium arsenide (GaAs) components, are leading the way in providing the high-performance radar capabilities required for modern defence and surveillance.
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Telecoms, Datacoms, Wireless, IoT
u-blox has achieved what was once thought impossible with the launch of the DAN-F10N, the industry’s smallest and most reliable L1, L5 dual-band GNSS antenna module.
Read more...u-blox expands NORA-B2 BLE modules RF Design
Telecoms, Datacoms, Wireless, IoT
The new nRF54L chipset-based wireless modules reduce current consumption and double processing capacity, catering to diverse mass market segments.
Read more...HiRel components from Kyocera AVX Electrocomp
Passive Components
Kyocera AVX Corporation is a leading supplier of advanced components and interconnect solutions, offering a broad selection of passive components and connectors.
Read more...New GNSS passive patch antenna RF Design
Telecoms, Datacoms, Wireless, IoT
The HP24510A from Taoglas is a stacked patch GNSS passive antenna that operates from 1215 to 1610 MHz covering the L1/L2 GNSS spectrum.
Read more...Tiny power inductor for low noise applications iCorp Technologies
Passive Components
With the evolution of Bluetooth, chips, sensors and other technologies, the design of TWS earphones is becoming smaller and thinner, and the performance and size requirements of integrated inductors need to follow suit.
Read more...6 – 18 GHz driver amplifier RF Design
Telecoms, Datacoms, Wireless, IoT
The QPA0022D from Qorvo is a high-performance driver amplifier covering a range of 6 to 18 GHz and fabricated on Qorvo’s production 0,15 µm pHEMT process.
Read more...3,75 GHz RF inductor RF Design
Passive Components
The ceramic chip wire wound inductor from Coilcraft features a DC resistance of 1 O, a DC current of 175 mA, and a self-resonant frequency of 3,75 GHz.
Read more...Upgraded power inductor series iCorp Technologies
Passive Components
Sunlord’s multiphase co-fired power inductor HTF-MP series has upgraded the single-phase HTF-H products in terms of integrated applications.
Read more...IoT in a Box RF Design
Telecoms, Datacoms, Wireless, IoT
RAKwireless and Datacake have collaborated on a solution called ‘Real IoT in a Box’ to address the complexities of deploying IoT solutions, particularly when it comes to LoRaWAN.