1 January 2017
Manufacturing / Production Technology, Hardware & Services
DC 340 heatsink compound from Dow Corning features a high thermal conductivity and provides low bleed benefits. The fluid is thickened with a heat conductive metal oxide filler that gives the compound its high thermal conductivity, low bleed benefits and high temperature stability. The compound can resist consistency changes at temperatures up to 177°C, resulting in a positive seal of the heatsink. This enables the compound to provide increased efficiency by improving the heat transport from the electronic device.
DC 340 is ideal for aircraft engines, LED applications, mounting studs of transistors, diodes and silicon-controlled rectifiers. Additionally, the compound serves as a thermal coupler for heatsink devices and is stable at high temperatures.
The compound is available in multiple packaging sizes from small tubes for individual use to drums for large scale operations and production lines.
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printer friendly version