For D/D2/D3 PAK, Aavid's DPak thermal solution allows circuit designers to decrease the device case temperature by 17°C at 2 W power dissipation, or increase the maximum power handling capability of the device by 1 W (over that achievable without an added heatsink solution in A100 LFM forced airflow cooling environment).
Made of high conductivity copper they are coated with a 63/37 tin/lead solder that makes attachment easy in any surface mount process. Aavid designs all parts with a flat surface ideal for automated assembly using standard vacuum pick-and-place equipment.
Aavid's surface mount thermal solutions offer a 30% improvement in thermal resistance from case-to-ambient.
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