Coilcraft’s XFL6012 series of shielded power inductors combine high current handling and low DC resistance in a rugged, low-profile package. Measuring just 6,56 x 6,36 mm with a maximum height of only 1,2 mm, they exhibit DC resistance as low as 7,06 m and current ratings as high as 14,3 A.
The high-performance, moulded parts are mechanically rugged and magnetically shielded, making them suitable in high-density circuits. They are offered in five inductance values from 0,18 μH to 1,0 μH, feature RoHS compliant tin-silver over copper terminations, and withstand a maximum reflow temperature of 260°C. COTS Plus tin-lead terminations are also available.
The role of passives in emerging applications
Passive Components
Mouser Electronics has released a new eBook in collaboration with Bourns, exploring the role of passives in emerging electronics applications, including renewables, hybrids, and electric vehicles.
Read more...Updated curve fit equation tool
Passive Components
A new version of Magnetics’ Curve Fit Equation tool, which is an Excel file for design engineers, is now available.
Read more...Updated curve fit equation tool Tamashi Technology Investments
Passive Components
A new version of Magnetics’ Curve Fit Equation tool, which is an Excel file for design engineers, is now available.
Read more...PCB connectors for power systems Phoenix Contact
Passive Components
With the new PC 6 PCB connectors with screw connection, Phoenix Contact’s classic connection technology is available with enhanced touch protection for the new pin connector pattern.
Read more...SPE connector range Phoenix Contact
Passive Components
Single Pair Ethernet (SPE) is a communication technology that realises Industry 4.0 and IIoT applications, and Phoenix Contact’s Combicon range are ideal for SPE connections.
Read more...TDK expands MLCC series RS South Africa
Passive Components
TDK Corporation has expanded its CGA series of multilayer ceramic capacitors, currently being the highest capacitance in 100 V products for automotive applications.
Read more...SiP supports LTE/NB-IoT and GNSS RF Design
DSP, Micros & Memory
The nRF9151 from Nordic Semiconductor is an integrated System-in-Package that supports LTE-M/NB-IoT, DECT NR+ and GNSS services.
Read more...Nordic expands nRF91 series RF Design
DSP, Micros & Memory
Nordic Semiconductor has announced the expansion of its nRF91 series cellular IoT devices with the introduction of the nRF9151 System-in-Package (SiP).
Read more...LEXI-R10 series cellular module RF Design
Telecoms, Datacoms, Wireless, IoT
The LEXI-R10 Series from u-blox are LTE Cat 1 bis modules that support multi-band LTE-FDD, and are designed for size-constrained devices.
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