Providing a comprehensive software ecosystem for simplified microcontroller development, Texas Instruments announced the new MSP430Ware software and resource package.
MSP430Ware offers a sleek and intuitive graphical user interface (GUI) where developers can immediately access and easily filter through all MSP430 microcontroller design resources by device, tool or software library.
With automatic web updates, MSP430Ware ensures developers always have the latest documentation, code examples, project templates and more. Developers can also take advantage of MSP430Ware’s free software resources in a familiar design setting as part of the Code Composer Studio integrated development environment (IDE).
MSP430Ware features a one-stop-shop for MSP430 microcontroller developers by organising and presenting existing software tools as well as new resources such as the MSP430 driver library. This library allows designers to configure, enable and use MSP430F5xx and MSP430F6xx microcontroller peripherals through an easy-to-understand application programming interface (API) and simple function calls. This abstracted API library eliminates bitwise programming, providing a faster time to market for new and experienced developers.
Also packaged within MSP430Ware are project templates for Grace 1.1, the most recent version of the Grace software platform, which enables developers to quickly and easily enable and configure MSP430 Value Line and MSP430F2xx device peripherals. Additionally, the MSP430 USB developer’s package is also available, which includes all necessary APIs and examples to begin USB development.
Powering the intelligent edge EBV Electrolink
AI & ML
STMicroelectronics released new devices from the second generation of its industrial MPUs, the STM32MP2 series, to drive future progress in smart factories, smart healthcare, smart buildings, and smart infrastructure.
Read more...QLC Flash memory using BiCS tech EBV Electrolink
DSP, Micros & Memory
KIOXIA announced it had started shipping its 2 Tb Quad-Level-Cell memory devices with its 8th-generation BiCS FLASH 3D flash memory technology.
Read more...Integrated POL voltage regulators EBV Electrolink
Power Electronics / Power Management
Infineon’s TDA38807 and TDA38806 are their highest density high-efficiency integrated point-of-load (IPOL) solutions for smart enterprise systems.
Read more...UFS Flash named Best in Show EBV Electrolink
News
KIOXIA Europe GmbH was named as winner in the Memory & Storage category of the Embedded Computing Design (ECD) electronica Best in Show Awards at the recently held electronica 2024.
Read more...The power of UWB EBV Electrolink
Editor's Choice Telecoms, Datacoms, Wireless, IoT
Ultra-Wideband, the robust wireless communications technology commonly known as UWB, is such a versatile technology, capable of doing so many different things, that it can be hard to categorise.
Read more...Trimension family secures car access EBV Electrolink
Telecoms, Datacoms, Wireless, IoT
The Trimension NCJ29Dx family is part of NXP’s portfolio of secure car access system solutions, which includes the NCF3340 NFC controller and the KW37 Bluetooth 5.0 Long-Range MCU.
Read more...Altium provides free training
Design Automation
There is no longer any excuse not to master Altium Designer with the company now offering both advanced instructor-led three-day training and an on-demand video series.
Read more...Entry-level MCU with classical peripherals EBV Electrolink
DSP, Micros & Memory
NXP’s MCX C04x microcontrollers feature an Arm Cortex-M0+ core up to 48 MHz and offer 32 KB Flash, 2 KB SRAM, and 8 KB boot ROM.
Read more...Altium syncs your design and PCB programming software EDA Technologies
Design Automation
Altium Designer and Altium 365 can keep track of everything needed in PCB design, PCB programming language, component sourcing, and much more, as an embedded application is developed.
Read more...QLC Flash memory with the latest BiCS technology EBV Electrolink
Analogue, Mixed Signal, LSI
KIOXIA has implemented the groundbreaking CBA (CMOS directly Bonded to Array) technology, which enables the creation of higher density devices and an industry-leading interface speed of 3,6nbsp;Gbps.