Underscoring its commitment to leading-edge assembly technology, programmable logic solutions provider Actel, now has available new chip-scale packages for its eX family of field-programmable gate arrays. The new packages provide the smallest footprint in the industry for devices of comparable density, says the company. The eX products are already utilised in portable designs due to the family's small packaging and low power features. This new package further reduces board space by 66%, making Actel's eX family even more attractive for e-appliance, communications and computer networking applications where size limitations are critical.
"We have had tremendous success with the eX family in the portable market," said Ken O'Neill, Director of Product Marketing at Actel. "The new chip-scale packaging provides an even smaller footprint for these applications, which must meet increasingly demanding miniaturisation requirements. By featuring a low-cost, low-power and small footprint option for designers, the eX family has been instrumental in helping Actel continue its dominance of the logic integration market for consumer and e-appliance applications."
First introduced in September 2000, the eX family consists of three devices: the eX64, eX128 and eX256 with system gate densities of 3000, 6000 and 12 000, respectively. Actel offers a range of chip-scale packages, including 49, 128 and 180-ball packages.
For further information contact Kobus van Rooyen, ASIC Design Services, (011) 315 8316, [email protected]
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