Heatsinks feature push-pin mounting

17 August 2011 Circuit & System Protection

Advanced Thermal Solutions now provides maxiFLOW heatsinks with an integral push-pin mounting system for fast, safe attachment onto BGAs and other hot components.

Each heatsink comes with a pair of durable plastic or brass push-pins. The pins run through opposite corners of the heatsinks and mount securely into 3,00 mm holes in the PCB laid out in industry standard patterns. Plastic pins are lighter and non-electrically conductive, while brass pins have added strength and durability for more rugged applications or thicker devices. An integral spring on each pin provides approximately 9 Newtons of retention load, depending on the height of the component and the PCB thickness.

The patented ATS maxiFLOW sinks feature a low-profile, spread fin array that maximises surface area for effective convection cooling in the restricted airflow conditions typical of today’s condensed electronic packages. The heatsinks are fabricated from lightweight extruded aluminium which minimises thermal resistance from the base to the fins. They have a protective green anodised surface.

The push-pin mount maxiFLOW heatsinks are available in sizes ranging from 37,4 x 37,5 x 10,0 mm (L x W x H) up to 41,4 x 45,75 x 24,5 mm. Each maxiFLOW heatsink is provided preassembled with a Chomerics T766 phase change thermal interface material for improved component-to-sink thermal transfer. The pad is centred on the base of the sink.

For more information visit www.qats.com

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