Texas Instruments announced a new PLC (power line communications) development kit (TMDSPLCKIT-V2) based on a PLC modem solution capable of supporting multiple modulation and protocol standards on a single hardware platform. The new kit provides everything developers need to network systems and implement monitoring capabilities and other new services. Developers will be able to quickly evaluate the suitability of using PLC-based communications and then jumpstart development for Smart Grid applications ranging from smart electrical meters to intelligently controlled industrial applications, including lighting, solar, home automation, building control, plug-in electrical vehicle and energy-managed appliances.
TI’s PLC modem is a modular, fully programmable solution comprised of separate microcontroller (MCU) and analog front end (AFE) modules and a complete software framework designed for flexibility and adaptation to various application and regional requirements. The MCU module is based on TI’s proven real-time control C2000 architecture and offers elevated performance while interfacing with the AFE and application processors with which the PLC modem communicates.
TI also offers its comprehensive plcSUITE, a modular software framework separating modulation, protocol and application development for developers testing and designing with PLC modems.
KIOXIA pioneer new 3D Flash technology EBV Electrolink
DSP, Micros & Memory
KIOXIA Corporation and Sandisk Corporation have pioneered a state-of-the-art 3D flash memory technology, setting the industry benchmark with a 4,8 Gb/s NAND interface speed, superior power efficiency, and heightened density.
Read more...Super-fast H.264 encoder FPGA core EBV Electrolink
DSP, Micros & Memory
An ITAR-compliant H.264 core designed for AMD FPGAs provides baseline H.264 support and is currently the smallest and fastest FPGA core in the industry.
Read more...Power IC supplies 1650 W EBV Electrolink
Power Electronics / Power Management
Power Integrations has announced a two-fold increase in power output from the HiperLCS-2 chipset with the new device now being able to deliver up to 1650 W of continuous output power.
Read more...MPLAB PICkit Basic ASIC Design Services
Design Automation
To make its robust programming and debugging capabilities accessible to a wider range of engineers, Microchip Technology has launched the MPLAB PICkit Basic in-circuit debugger.
Read more...Accelerating RF PCB design in a 5G world ASIC Design Services
Editor's Choice Design Automation
Billions of IoT devices coming online in the coming years will require RF design capabilities that support ultra-fast 5G speeds.
Read more...NECTO Studio has been updated
Design Automation
NECTO Studio V7.1 IDE from MIKROE now includes full programmer and debug support for Microchip tools and also adds support for Microchip’s SAM MCU and STMicroelectronics’ STM32L4 series of ultra-low-power MCUs.
Read more...Powering the intelligent edge EBV Electrolink
AI & ML
STMicroelectronics released new devices from the second generation of its industrial MPUs, the STM32MP2 series, to drive future progress in smart factories, smart healthcare, smart buildings, and smart infrastructure.
Read more...QLC Flash memory using BiCS tech EBV Electrolink
DSP, Micros & Memory
KIOXIA announced it had started shipping its 2 Tb Quad-Level-Cell memory devices with its 8th-generation BiCS FLASH 3D flash memory technology.
Read more...Integrated POL voltage regulators EBV Electrolink
Power Electronics / Power Management
Infineon’s TDA38807 and TDA38806 are their highest density high-efficiency integrated point-of-load (IPOL) solutions for smart enterprise systems.