Semiconductors in TO 220 and TO 218 enclosure designs are usually secured to the selected heatsink by means of a screwed connection for the requisite cooling, which results in spot contact pressure in the area of the securing flap. On the other hand, the contact pressure on the underside of the semiconductor, ie, where the primary heat is emitted, is lower. This in turn gives rise to an increased heat transmission resistance from the semiconductor to the heatsink in this area – creating so-called ‘hot spots’.
The new contact pressure heatsinks in Alutronic’s AK 350 and AK 352 ranges are designed in such a way that when screw-connected, they distribute the contact pressure to the main heatsink across the entire surface of the underside of the semiconductor. Dimensional tolerances on the part of the semiconductor enclosure are largely offset by the design of the heatsinks. In addition to optimising the contact pressure and reducing the contact resistance, these contact pressure heatsinks also provide additional cooling of the components across the top where the heatsinks can also be mounted as individual heatsinks. The main application is however in areas where safe assembly and optimised heat transmission from the semiconductor to the heatsink are required. The new heatsinks in the AK 350 and AK 352 ranges are designed for individual assembly as standard. Special dimensions are also available on request, eg, for multiple assembly.
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