New from ON Semiconductor are two electrostatic discharge (ESD) protection devices housed in its new, ultra-small 0201 Dual Silicon No-Lead (DSN-2) package measuring just 0,6 x 0,3 x 0,3 mm. The company’s first offerings in the new package are the ESD11N5.0ST5G and ESD11B5.0ST5G, which are an expansion of its high-performance off-chip ESD protection portfolio.
The ESD11N is a 0,6 pF device that utilises patented integrated ESD technology which enhances clamping performance while maintaining low capacitance. The low capacitance value ensures that this device has negligible impact on the signal integrity of high-speed data lines, making it suitable for applications such as USB2.0 and HDMI. In addition, the ESD11N maintains less than 0,5 dB insertion loss up to 3 GHz and excellent capacitance linearity over voltage and frequency, making it suitable for protecting high frequency antenna lines with minimal effects. The ESD11B is a 15 pF device for general-purpose and low-speed data lines that have tight board designs with limited room.
Both new ESD products clamp an input ESD waveform of 8 kV per the IEC61000-4-2 contact standard, to less than 10 V in a matter of nanoseconds.
Webinar: Game-changing Matter standard EBV Electrolink
Telecoms, Datacoms, Wireless, IoT
Join Infineon for an exclusive one-hour webinar with EBV Elektronik, exploring the groundbreaking Matter standard, and its profound implications for the future of smart homes.
Read more...Microchip introduces ECC608 TrustMANAGER Altron Arrow
Circuit & System Protection
To increase security on IoT products and facilitate easier setup and management, Microchip Technology has added the ECC608 TrustMANAGER with Kudelski IoT keySTREAM, Software as a Service (SaaS) to its Trust Platform portfolio of devices, services and tools.
Read more...General-purpose MCU with RISC-V architecture EBV Electrolink
DSP, Micros & Memory
Renesas has released a general-purpose MCU to enhance its existing RISC-V portfolio, and this is its first MCU using a RISC-V core developed internally at the company.
Read more...AI-native IoT platform launched EBV Electrolink
AI & ML
These highly-integrated Linux and Android SoCs from Synaptics are optimised for consumer, enterprise, and industrial applications and deliver an ‘out-of-the-box’ edge AI experience.
Read more...Serial SRAM up to 4 MB EBV Electrolink
DSP, Micros & Memory
The chips are designed to provide a lower-cost alternative to traditional parallel SRAM products, and include optional battery backup switchover circuitry in the SRAM memory to retain data on power loss.
Read more...Microchip expands its mSiC solutions EBV Electrolink
Power Electronics / Power Management
The highly integrated 3,3 kV XIFM plug-and-play digital gate driver is designed to work out-of-the-box with high-voltage SiC-based power modules to simplify and speed system integration.
Read more...Varistors for automotive applications Future Electronics
Circuit & System Protection
TDK Corporation has announced the addition of two new varistors to its AVRH series for automotive applications where both are characterised by the high electrostatic discharge-withstanding voltage demanded to ensure the safe operation of safety-critical automotive functions.
Read more...Powering up the intelligent edge EBV Electrolink
DSP, Micros & Memory
STMicroelectronics is releasing new devices from the second generation of its industrial microprocessors (MPUs), the STM32MP2 series, to drive future progress in smart factories, smart healthcare, smart buildings, and smart infrastructure.
Read more...Flash for AI EBV Electrolink
AI & ML
SCM offers a midway latency point between DRAM and SSDs, and when coupled with the introduction of CXL, low-latency flash, such as XL-FLASH, is well-positioned to deliver improvements in price, system performance, and power consumption to everything from servers to edge devices deploying the power of AI.
printer friendly version