Vishay Intertechnology recently announced the release of its latest isolation amplifiers, the VIA0050DD, VIA0250DD, and VIA2000SD. These new devices offer enhanced performance for a wide range of industrial, medical, and automotive applications, where high precision, reliability, and compact size are critical.
The VIA series of isolation amplifiers are designed to deliver exceptional thermal stability and precise measurement capabilities. Each amplifier features low offset error and drift, reinforced isolation, and inbuilt diagnostics for simplified precision current and voltage measurements. Inbuilt common mode voltage detection prevents failures in current and voltage measurement applications, making these amplifiers particularly suited for demanding applications where reliability is paramount.
The amplifiers offer common-mode transient immunity to 150 kV/μs, providing robust performance even in harsh environments. They exhibit a low gain error of ±0,05% and minimal gain drift of 15 ppm/°C. A wide operating temperature range of -40 to 125°C makes it ideal for use in bus voltage monitoring, AC motor controls, power and solar inverters, and industrial motor drives.
High-performance IMU RS South Africa
Analogue, Mixed Signal, LSI
TDK Corporation has announced availability of the new InvenSense SmartMotion ICM-536xx family of high-performance 6-axis IMUs.
Read more...MCU for noisy environments EBV Electrolink
DSP, Micros & Memory
The MCX?E24X is a high-performance microcontroller family from NXP, engineered for industrial, automotive-like, and energy-focused environments.
Read more...High-temperature closed-loop MEMS accelerometer RS South Africa
Analogue, Mixed Signal, LSI
This sensor from TDK is a high-temperature MEMS accelerometer with ±14 g input range and a digital interface for measurement while drilling applications.
Read more...Chip provides concurrent dual connectivity EBV Electrolink
Telecoms, Datacoms, Wireless, IoT
The IW693 from NXP is a 2x2 dual-band, highly integrated device that provides concurrent dual Wi-Fi 6E + Wi-Fi 6 and Bluetooth connectivity, supporting four different modes.
Read more...Dual accelerometers on the same die Altron Arrow
Analogue, Mixed Signal, LSI
The LSM6DSV320X is the first mainstream inertial sensor to house a gyroscope alongside two accelerometers, one capable of sensing up to ±16 g and one sensing up to a staggering ±320 g.
Read more...Dual-range IMU with edge processing EBV Electrolink
Analogue, Mixed Signal, LSI
ST’s innovative LSM6DSV80X combines two accelerometer structures for 16 g and 80 g full-scale sensing, a gyroscope up 4000 dps, and embedded intelligence in a single component.
Read more...Mibbo QT2C Series signal isolators Conical Technologies
Analogue, Mixed Signal, LSI
The Mibbo QT2C Series isolators support a rich combination of input and output signals, working with either current loops or voltage levels.
Read more...First NVMe SSD Built with 8th-gen BiCS FLASH EBV Electrolink
Computer/Embedded Technology
KIOXIA recently announced the development and prototype demonstration of its new KIOXIA CM9 Series PCIe 5.0 NVMe SSDs, which incorporates CMOS directly Bonded to Array technology.
Read more...IMU with dual-sensing capability EBV Electrolink
Analogue, Mixed Signal, LSI
ST’s 6-axis inertial measurement unit integrates a dual accelerometer up to 320g and embedded AI for activity tracking and high-impact sensing.
Read more...Plural data converter series
Analogue, Mixed Signal, LSI
Silanna Semiconductor has announced the launch of Plural, a new generation of data converters for customers eager to find a more available, affordable, high-performance alternative to existing brands.
While every effort has been made to ensure the accuracy of the information contained herein, the publisher and its agents cannot be held responsible for any errors contained, or any loss incurred as a result. Articles published do not necessarily reflect the views of the publishers. The editor reserves the right to alter or cut copy. Articles submitted are deemed to have been cleared for publication. Advertisements and company contact details are published as provided by the advertiser. Technews Publishing (Pty) Ltd cannot be held responsible for the accuracy or veracity of supplied material.
printer friendly version