Thermal interface adhesive

5 August 2009 Manufacturing / Production Technology, Hardware & Services

Bergquist has combined high thermal conductivity with low viscosity in its new Liqui-Bond SA 1800 screen-printable thermal interface adhesive, to enable optimum heat transfer with low bond-line thickness when attaching heatsinks to components or modules without using mechanical fixings.

The product is an easy-to-use, one-part silicone adhesive of thermal conductivity 1,8 W/m-K, which requires no mixing and is compatible with high-speed screen printing or dispensing. The adhesive cures at elevated temperature to create a stable, structural bond exhibiting high shear strength. This allows manufacturers to eliminate conventional fixings such as screws, clamps or clips, thereby saving assembly time, complexity and cost.

Available in 30 cc or 600 cc dispense cartridges, or in bulk containers, Liqui-Bond SA 1800 can be dispensed or printed onto the surface of discrete components or modules such as voltage regulators, power supplies, point-of-load regulators, amplifiers, motor controllers and automotive ECUs. Optional glass spacer beads may also be specified, for applications requiring electrical isolation.

The adhesive has a UL 94V-0 flammability rating and is RoHS compliant.

For more information visit www.bergquistcompany.eu

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