Harwin has introduced a new range of surface-mount EMI/RFI shield clips which are aimed at reducing assembly time and simplifing rework by eliminating secondary soldering operations.
Supplied in industry-standard tape-and-reel packaging, these RFI shield clips are positioned on a printed circuit board and soldered using standard SMT placement equipment. The shielding can is then simply pushed into place during final assembly. Because it is possible to remove and refit the can a number of times, adjustment and rework operations are simplified.
The clips are available in two sizes: the larger Midi clip can handle cans with a wall thickness of 0,3 mm and is available in beryllium copper and beryllium-free copper; the smaller Mini version is only available in beryllium copper, and suits cans with 0,13 mm to 0,23 mm thick walls.
Harwin’s EMI/RFI clips are targeted at telecommunications, data communications, data processing and in-car entertainment systems.
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