Interconnection


Surface mounted modular jacks for advanced telecommunications applications

28 March 2001 Interconnection

Maxconn, a subsidiary of Erni, offers a line-up of surface-mounted modular jack connectors aimed at the OEM customers of telecommunications equipment that make Fast Ethernet and Gigabit-technology modems and computer peripheral products. The product line consist of single-port and gang multiport modular jacks with from 1 to 8 positions, shielded and nonshielded, in all RJ11/12 and RJ45/48 configurations typically used in Fast Ethernet applications. The standard products are plated with 0,76 micron of gold. Optional 1,27 micron gold plating is also available. They are rated for 1000 mating cycles and can be mounted with or without a PCB locating post. The shielded versions are available with either SMT or through-hole leads for positive PCB grounding to chassis. Maxconn's unique design allows for positive alignment from pin to pin and port to port for multigang contact positioning and passes the 1,5 kV high-voltage test. The new modem and Fast Ethernet connector sits offset below the surface of the board, making it the ideal connector for portable equipment and handheld products.



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