25 July 2007Manufacturing / Production Technology, Hardware & Services
DEK platinum represents what the company claims is a breakthrough in the critical field of stencil technologies, delivering exceptional and repeatable precision for a diverse range of demanding applications. Founded on a novel MEMS-based fabrication process, high accuracy platinum stencils are capable of achieving the ultra-fine geometries now standard in the majority of today's interconnection technologies. In fact, platinum is claimed to overcome the limitations of conventional stencil systems to meet every ultra-fine pitch printing requirement.
The stencils' superior print performance means that the technology is ideally suited to a range of demanding manufacturing applications including BGAs, direct chip attach, flip chip and wafer level packaging. Facilitating apertures of 20 μm on 50 μm pitch, platinum stencils offer exceptionally smooth sidewalls for highly efficient paste transfer - even when dealing with square apertures.
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Read more...The successful development of PCBWay’s 24-layer, 6-order arbitrary interconnection HDI PCB
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[Sponsored] The so-called interposer PCB is a highly precise, high-layer arbitrary interconnection HDI PCB that serves not only as a critical component for connecting and integrating different electronic components, but also acts as an intermediary layer for chip connections.
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