Lead-free no-clean solder paste offers a variety of benefits
20 September 2006Manufacturing / Production Technology, Hardware & Services
Kester's Enviromark 918 (EM918) is a lead-free, halide-free, no-clean air or nitrogen, reflowable solder paste with probable residues and superior activity. According to the manufacturer, its clear residue, excellent cosmetic appearance and shiny solder joints make it a comparable substitute for typical tin-lead solder joints, especially with EM918 being able to wet very well in air reflow without the need of nitrogen. It shows superior wettability on all printed wire board finishes.
EM918 has robust print capabilities and is capable of high speed printing (up to 150 mm/s). the manufacturer says that EM918 has proven to release consistently from the stencil for these critical fine-pitch applications (0,4 mm) with anti-slump characteristics and preferred solder paste deposit definition; and the print quality of EM918 remains excellent even with extended downtime of 60 minutes and more.
Other attributes include: excellent solderability to a wide variety of surface metallisations, including Ni/Au, Immersion Sn, and Immersion Ag, and excellent solderability to a wide variety of component metallisations, including Pd/Ag; extended stencil life (process dependent); clean cosmetic aesthetics after reflow; and stable tack life.
The formula is IPC-compliant and is classified as ROL0 per J-STD-004A.
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