At Schroff, ‘electronic packaging’ means more than just 19” plug-in units and subracks. It means the integration of electro-mechanical and electronic components, such as backplanes, power supplies, switches and cabling into an enclosure system. Technical solutions for EMC, cooling and monitoring belong to the service package in the same way as assembly and fast track deliveries.
CompactPCI systems for horizontal board assembly
Standard CompactPCI systems can, for example, form the basis of an integrated system, whereby all necessary additional items such as disk drives, peripherals and I/O can be built into the standard system prior to delivery. The system slot is located at the bottom, therefore CPUs of double width (8 HP) can be used. Additionally there is an assembly space for horizontal, 80 mm deep, rear I/O boards with IEEE guide rails inclusive ESD clips. At the left side of the system is a pluggable hot-swappable cooling unit with four integrated, quiet fans. A 75% level of chassis perforation guarantees good ventilation and cooling. As an option, three further fans can be installed for the cooling of the rear I/O area. A fan control can also be integrated.
Monolithic backplane included
For CompactPCI systems with horizontal board assembly, Schroff has developed a new 64-bit range of CompactPCI backplanes with rear I/O that conforms to PICMG 2.0 Rev. 3.0. The backplanes for 6U CompactPCI hot-swappable boards are available for 2, 4, 6 and 8 slot versions. They are configured as continuous monolithic 9U backplanes with an integrated 3U wide area for pluggable 3U/8 HP hot-swappable power supplies.
With the 'monolithic solution' the cabling effort between power backplane and CompactPCI backplane and voltage losses on the cables, are avoided. As a standard there are one or two connection facilities (P47 connectors) on the power backplane for the assembly of 19" CompactPCI power supplies, which can be operated parallel or redundantly.
Front panels
As a rule, the front panels of a 19" plug-in unit or an enclosure have to be configured individually. Standard front panels, that are different in size and finish (eg with or without EMC shielding, for CompactPCI, VME, AdvancedTCA systems or for AdvancedMC boards) are available from the Schroff catalogue.
Apart from the mechanical processing such as drilling, milling, cutting threads and profiling, Schroff offers powder coating and screen printing of the front panels, including the production of transparencies. The integration of mounting and EMC shielding kits, eg, collar screws, handles, PB holders and HF springs is also possible.
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| www: | www.actum.co.za |
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