Rogers introduced its new RO4450B-dx Bondply, a high fill/flow version of its RO4450B series high frequency circuit material, at this year's Del Mar Electronics Show.
RO4450B Series circuit material is a glass-reinforced hydrocarbon/ceramic thermoset bondply designed for performance-sensitive, multilayer printed circuit boards. These bondplys are designed to offer high frequency performance and low cost circuit fabrication. The result is a low loss material, which can be fabricated using standard epoxy/glass (FR4) processes. The new RO4450B-dx is a high fill/flow version of the RO4450B bondply. It is designed to fill those high-density designs while still offering thin dielectric spacing.
RO4403, RO4450B, and RO4450B-dx prepregs are based upon the RO4000 series core materials and are compatible in multilayer constructions with either RO4003C or RO4350B laminates. As with RO4000 laminates, RO440 prepregs are compatible with the majority of standard FR4 processing practices.
The role of passives in emerging applications
Passive Components
Mouser Electronics has released a new eBook in collaboration with Bourns, exploring the role of passives in emerging electronics applications, including renewables, hybrids, and electric vehicles.
Read more...Updated curve fit equation tool
Passive Components
A new version of Magnetics’ Curve Fit Equation tool, which is an Excel file for design engineers, is now available.
Read more...Updated curve fit equation tool Tamashi Technology Investments
Passive Components
A new version of Magnetics’ Curve Fit Equation tool, which is an Excel file for design engineers, is now available.
Read more...PCB connectors for power systems Phoenix Contact
Passive Components
With the new PC 6 PCB connectors with screw connection, Phoenix Contact’s classic connection technology is available with enhanced touch protection for the new pin connector pattern.
Read more...SPE connector range Phoenix Contact
Passive Components
Single Pair Ethernet (SPE) is a communication technology that realises Industry 4.0 and IIoT applications, and Phoenix Contact’s Combicon range are ideal for SPE connections.
Read more...TDK expands MLCC series RS South Africa
Passive Components
TDK Corporation has expanded its CGA series of multilayer ceramic capacitors, currently being the highest capacitance in 100 V products for automotive applications.
Read more...SiP supports LTE/NB-IoT and GNSS RF Design
DSP, Micros & Memory
The nRF9151 from Nordic Semiconductor is an integrated System-in-Package that supports LTE-M/NB-IoT, DECT NR+ and GNSS services.
Read more...Nordic expands nRF91 series RF Design
DSP, Micros & Memory
Nordic Semiconductor has announced the expansion of its nRF91 series cellular IoT devices with the introduction of the nRF9151 System-in-Package (SiP).
Read more...LEXI-R10 series cellular module RF Design
Telecoms, Datacoms, Wireless, IoT
The LEXI-R10 Series from u-blox are LTE Cat 1 bis modules that support multi-band LTE-FDD, and are designed for size-constrained devices.
printer friendly version