28 July 2004Manufacturing / Production Technology, Hardware & Services
DEK says its latest additive stencil technology allows users to create deposits of several heights in a single pass, to increase throughput, reduce the number of process steps, and increase equipment use. Creating multiple deposit heights also enhances the lifetime of squeegee blades or the wipers of an enclosed printing head, as well as the stencil.
Building up selected areas on the stencil surface allows the height of selected deposits to be increased by between 10 and 100 µm compared with the nominal height determined by the main stencil thickness. The stencil can be built up in any area to meet customer requirements. The technique also allows DEK stencil designers to smooth the edges of the enhanced areas, allowing metal squeegees or the wipers of an enclosed head such as the DEK ProFlow transfer head to ride-on and ride-off easily. This extends the lifetime of the squeegee or wiper, as well as the stencil, and enhances process control and repeatability.
DEK says that the new technology is suitable when more than one stencil would traditionally be used, or where volumes of paste need to vary, or even for different component placements such as edge connectors. Manufacturing tolerances are as follows: minimum distance between two deposits is ±0,5 mm; the maximum area is 40 x 40 mm; and the deposit thickness is a maximum of 0,075 mm.
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